Inventor · disambiguated record
Shigeru Hayata
Also filed as: HAYATA SHIGERU
24 granted patents·3 pending applications·396 citations·filing 1993–2021
96Inventor score
Top patents by PatentIndex Score
27 records- 0196US5345292AIllumination device for projection exposure apparatusCANON KK·Filed 1993·Granted Sep 6, 1994·98 cites·60 claims
- 0285US10118246B2Mounting apparatusSHINKAWA KK·Filed 2017·Granted Nov 6, 2018·9 cites·12 claims
- 0384US5726740AProjection exposure apparatus having illumination device with ring-like or spot-like light sourceCANON KK·Filed 1995·Granted Mar 10, 1998·48 cites·24 claims
- 0483US7886956B2Bonding apparatus and bonding stage height adjustment method for the bonding apparatusSHINKAWA KK·Filed 2010·Granted Feb 15, 2011·7 cites·6 claims
- 0581US6464126B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2001·Granted Oct 15, 2002·32 cites·10 claims
- 0678US6467673B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2000·Granted Oct 22, 2002·27 cites·9 claims
- 0777US10586781B2Bonding apparatus and method of estimating position of landing point of bonding toolSHINKAWA KK·Filed 2016·Granted Mar 10, 2020·3 cites·6 claims
- 0874US10262968B2Wire bonding apparatus and wire bonding methodSHINKAWA KK·Filed 2017·Granted Apr 16, 2019·2 cites·15 claims
- 0973US5367404AImage projection method and semiconductor device manufacturing method using the sameCANON KK·Filed 1994·Granted Nov 22, 1994·27 cites·10 claims
- 1071US5726739AProjection exposure apparatus and device manufacturing method using the sameCANON KK·Filed 1994·Granted Mar 10, 1998·48 cites·49 claims
- 1170US6311391B1Flip-chip bonding apparatusSHINKAWA KK·Filed 1999·Granted Nov 6, 2001·45 cites·7 claims
- 1267US6762848B2Offset measurement method, tool position detection method and bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 13, 2004·13 cites·4 claims
- 1361US6945446B2Wire bonding method and apparatusSHINKAWA KK·Filed 2002·Granted Sep 20, 2005·10 cites·7 claims
- 1458US7848022B2Imaging device and method for a bonding apparatusSHINKAWA KK·Filed 2008·Granted Dec 7, 2010·1 cites·12 claims
- 1555US6657799B2Wire bonding apparatusSHINKAWA KK·Filed 2002·Granted Dec 2, 2003·6 cites·4 claims
- 1654US12261148B2Wire bonding apparatusSHINKAWA KK·Filed 2021·Granted Mar 25, 2025·0 cites·17 claims
- 1753US12374650B2Manufacturing apparatus and manufacturing method of semiconductor deviceSHINKAWA KK·Filed 2021·Granted Jul 29, 2025·0 cites·10 claims
- 1851US6814121B2Bonding apparatusSHINKAWA KK·Filed 2002·Granted Nov 9, 2004·4 cites·10 claims
- 1950US12057427B2Wire bonding apparatusSHINKAWA KK·Filed 2021·Granted Aug 6, 2024·0 cites·13 claims
- 2047US6683731B2Bonding apparatusSHINKAWA KK·Filed 2002·Granted Jan 27, 2004·2 cites·3 claims
- 2146US2009059361A1Imaging device and method for a bonding apparatusSHINKAWA KK·Filed 2008·Application pending·0 cites
- 2246US2010067123A1Imaging device for a bonding apparatusSHINKAWA KK·Filed 2008·Application pending·0 cites
- 2340US10816322B2Bonding apparatus and method for detecting height of bonding targetSHINKAWA KK·Filed 2017·Granted Oct 27, 2020·0 cites·11 claims
- 2438US11367703B2Bonding apparatusSHINKAWA KK·Filed 2018·Granted Jun 21, 2022·0 cites·13 claims
- 2538US6381359B1Bonding apparatusSHINKAWA KK·Filed 1999·Granted Apr 30, 2002·7 cites·5 claims
- 2638US6055039AIllumination system and exposure apparatus using the sameCANON KK·Filed 1996·Granted Apr 25, 2000·7 cites·64 claims
- 2737US2017148759A1Bonding apparatus and bonding methodSHINKAWA KK·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shigeru Hayata files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →