Inventor · disambiguated record
Shi-Wei He
Also filed as: HE SHI-WEI
4 granted patents·1 pending application·1 citations·filing 2019–2025
58Inventor score
Files withFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD5
Top patents by PatentIndex Score
5 records- 0168US11164877B2Semiconductor device having void in bit line contact plugFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2019·Granted Nov 2, 2021·1 cites·10 claims
- 0267US11678479B2Method of fabricating semiconductor device having void in bit line contact plugFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·16 claims
- 0364US12495554B2Three-dimensional memory device and method for fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·11 claims
- 0459US2025246548A1Three-dimensional memory device and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2025·Application pending·0 cites
- 0554US12300607B2Three-dimensional memory deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted May 13, 2025·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →