Inventor · disambiguated record
Sharath Hegde
Also filed as: HEGDE SHARATH
2 granted patents·10 pending applications·13 citations·filing 2001–2022
58Inventor score
Files withNYACOL NANO TECHNOLOGIES INC3CLIMAX ENGINEERED MAT LLC2INTEL CORP1JHA SUNIL C1UNIV CLARKSON1
Top patents by PatentIndex Score
12 records- 0180US7186653B2Polishing slurries and methods for chemical mechanical polishingCLIMAX ENGINEERED MAT LLC·Filed 2005·Granted Mar 6, 2007·7 cites·2 claims
- 0273US7723234B2Method for selective CMP of polysiliconUNIV CLARKSON·Filed 2006·Granted May 25, 2010·6 cites·16 claims
- 0351US2024194732A1Chemical mechanical polishing of carbon hard maskINTEL CORP·Filed 2022·Application pending·0 cites
- 0448US2008277378A1Method for Chemical-Mechanical Planarization of CopperCLIMAX ENGINEERED MAT LLC·Filed 2008·Application pending·0 cites
- 0543US2007043230A1Polishing slurries and methods for chemical mechanical polishingJHA SUNIL C·Filed 2006·Application pending·0 cites
- 0642US2005136673A1CMP slurryFiled 2005·Application pending·0 cites
- 0738US2003047710A1Chemical-mechanical polishingNYACOL NANO TECHNOLOGIES INC·Filed 2001·Application pending·0 cites
- 0838US2003092271A1Shallow trench isolation polishing using mixed abrasive slurriesNYACOL NANO TECHNOLOGIES INC·Filed 2002·Application pending·0 cites
- 0938US2005022456A1Polishing slurry and method for chemical-mechanical polishing of copperFiled 2003·Application pending·0 cites
- 1036US2005028450A1CMP slurryFiled 2003·Application pending·0 cites
- 1134US2005026444A1Slurry and method for chemical-mechanical planarization of copperFiled 2004·Application pending·0 cites
- 1234US2003211747A1Shallow trench isolation polishing using mixed abrasive slurriesNYACOL NANO TECHNOLOGIES INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →