Inventor · disambiguated record
Shingo Higuchi
Also filed as: HIGUCHI SHINGO
28 granted patents·8 pending applications·172 citations·filing 2005–2025
96Inventor score
Files withROHM CO LTD17NIPPON PILLAR PACKING10MIYATA OSAMU3MITSUBISHI ELECTRIC CORP2TERAOKA SEIKO KK2
Top patents by PatentIndex Score
36 records- 0197US7436063B2Packaging substrate and semiconductor deviceROHM CO LTD·Filed 2005·Granted Oct 14, 2008·70 cites·6 claims
- 0296US11708928B2Resin joint, channel block, and fluid control deviceNIPPON PILLAR PACKING·Filed 2020·Granted Jul 25, 2023·3 cites·7 claims
- 0396US8432046B2Semiconductor deviceMIYATA OSAMU·Filed 2011·Granted Apr 30, 2013·24 cites·32 claims
- 0493US7714448B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2005·Granted May 11, 2010·13 cites·9 claims
- 0591US9601441B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2016·Granted Mar 21, 2017·4 cites·15 claims
- 0691US9312228B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2015·Granted Apr 12, 2016·4 cites·15 claims
- 0789US11069591B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·19 claims
- 0889US9111819B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2014·Granted Aug 18, 2015·4 cites·22 claims
- 0988US8928156B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2014·Granted Jan 6, 2015·4 cites·22 claims
- 1088US8786106B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2013·Granted Jul 22, 2014·4 cites·11 claims
- 1186US10431516B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2017·Granted Oct 1, 2019·2 cites·11 claims
- 1285US8575764B2Semiconductor device and method for manufacturing semiconductor deviceMIYATA OSAMU·Filed 2010·Granted Nov 5, 2013·4 cites·13 claims
- 1381US7977771B2Semiconductor device and method of manufacturing semiconductor deviceROHM CO LTD·Filed 2009·Granted Jul 12, 2011·6 cites·3 claims
- 1479US12057362B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·19 claims
- 1579USD985739SGasketNIPPON PILLAR PACKING·Filed 2021·Granted May 9, 2023·6 cites·1 claims
- 1678US12158222B2Gasket and flow passage joint structureNIPPON PILLAR PACKING·Filed 2021·Granted Dec 3, 2024·1 cites·2 claims
- 1777US8659174B2Semiconductor deviceROHM CO LTD·Filed 2013·Granted Feb 25, 2014·3 cites·27 claims
- 1877US7928583B2Semiconductor deviceROHM CO LTD·Filed 2008·Granted Apr 19, 2011·7 cites·5 claims
- 1976US2025092968A1Pipe jointNIPPON PILLAR PACKING·Filed 2024·Application pending·0 cites
- 2074US9136218B2Semiconductor device including a protective filmROHM CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·22 claims
- 2172US8063495B2Semiconductor deviceMIYATA OSAMU·Filed 2006·Granted Nov 22, 2011·4 cites·53 claims
- 2269US9391037B2Semiconductor device including a protective filmROHM CO LTD·Filed 2015·Granted Jul 12, 2016·1 cites·26 claims
- 2366USD1086408SSleeveNIPPON PILLAR PACKING·Filed 2021·Granted Jul 29, 2025·4 cites·1 claims
- 2463US2024044425A1Pipe jointNIPPON PILLAR PACKING·Filed 2021·Application pending·0 cites
- 2558US2025305507A1Impeller and magnetic levitation type pumpPILLAR CORP·Filed 2025·Application pending·0 cites
- 2656US9698112B2Semiconductor device including a protective filmROHM CO LTD·Filed 2016·Granted Jul 4, 2017·0 cites·12 claims
- 2752US2011237064A1Method of manufacturing semiconductor deviceROHM CO LTD·Filed 2011·Application pending·0 cites
- 2850US12031645B2Sealing member and pipe jointNIPPON PILLAR PACKING·Filed 2021·Granted Jul 9, 2024·0 cites·6 claims
- 2950US11668292B2Rolling diaphragm pumpNIPPON PILLAR PACKING·Filed 2020·Granted Jun 6, 2023·0 cites·4 claims
- 3049US11900772B2Mobile terminal, weighing device, POS terminal, non-transitory computer-readable medium, sales processing system, and sales processing methodTERAOKA SEIKO KK·Filed 2021·Granted Feb 13, 2024·0 cites·12 claims
- 3148US12165122B2Weighing and pricing device, sales system, product registration processing method, program, and non-transitory computer-readable mediumTERAOKA SEIKO KK·Filed 2021·Granted Dec 10, 2024·0 cites·2 claims
- 3248US12025244B2Inner ring and pipe jointNIPPON PILLAR PACKING·Filed 2021·Granted Jul 2, 2024·0 cites·7 claims
- 3346US2019348683A1Flow path chip and manufacturing method for flow path chipALPS ALPINE CO LTD·Filed 2019·Application pending·0 cites
- 3444US2023175621A1Inner ring and pipe jointNIPPON PILLAR PACKING·Filed 2021·Application pending·0 cites
- 3543US2016353395A1Wireless communication apparatus and communication methodMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 3637US2009029657A1Auto frequency control methodMITSUBISHI ELECTRIC CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →