Inventor · disambiguated record
Shinji Hoshino
Also filed as: HOSHINO SHINJI
10 granted patents·10 pending applications·124 citations·filing 1993–2023
89Inventor score
Top patents by PatentIndex Score
20 records- 0190US7789600B2Tip dresserHONDA MOTOR CO LTD·Filed 2006·Granted Sep 7, 2010·16 cites·1 claims
- 0287US10836937B2Pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2016·Granted Nov 17, 2020·2 cites·15 claims
- 0384US8436481B2Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheetHOSHINO SHINJI·Filed 2010·Granted May 7, 2013·11 cites·6 claims
- 0475US12319048B2Sheet, moisture-proof method of adherend using the sheet and corrosion-proof method of metal plate using the sheetNITTO DENKO CORP·Filed 2021·Granted Jun 3, 2025·0 cites·16 claims
- 0575US5401127ARotative cutting tool of tip dresserHONDA MOTOR CO LTD·Filed 1993·Granted Mar 28, 1995·34 cites·17 claims
- 0667US5725340ATip dresserHONDA MOTOR CO LTD·Filed 1995·Granted Mar 10, 1998·28 cites·8 claims
- 0765US8502397B2Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheetYANAGI YUICHIRO·Filed 2010·Granted Aug 6, 2013·3 cites·6 claims
- 0865US2020290312A1Sheet, moisture-proof method of adherend using the sheet and corrosion-proof method of metal plate using the sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 0959US2018093451A1Sheet, moisture-proof method of adherend using the sheet and corrosion-proof method of metal plate using the sheetNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1055US2013186572A1Method of separating two adhered platesNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1153US2013005928A1Optical double-sided pressure-sensitive adhesive sheet, optical member, touch panel, image display device, and separating methodNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1252US5545872APressure controller and pressure control method for resistance welderHONDA MOTOR CO LTD·Filed 1994·Granted Aug 13, 1996·16 cites·8 claims
- 1351US5445481ADressing apparatus for an electrode tipHONDA MOTOR CO LTD·Filed 1993·Granted Aug 29, 1995·14 cites·9 claims
- 1451US2013186575A1Method of separating two adhered platesNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1551US2024034477A1Temperature control system and temperature control method and aircraftHONDA MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 1644US2013020031A1Method and apparatus for detaching plates joined to each otherNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1743US11772343B2Functionalized laminated optical element with improved edging resistanceESSILOR INT·Filed 2016·Granted Oct 3, 2023·0 cites·19 claims
- 1838US2013237017A1Pressure-sensitive adhesive tape for resin encapsulation and method for producing resin encapsulation type semiconductor deviceKONDO HIROYUKI·Filed 2012·Application pending·0 cites
- 1936US2011111563A1Adhesive tape for resin-encapsulating and method of manufacture of resin-encapsulated semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2026US2013240141A1Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tapeSOEJIMA KAZUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →