Inventor · disambiguated record
Shenavia S. Howell
Also filed as: HOWELL SHENAVIA · HOWELL SHENAVIA S
4 granted patents·1 pending application·4 citations·filing 2019–2024
61Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0177US12040246B2Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2020·Granted Jul 16, 2024·1 cites·15 claims
- 0276US11682605B2Integrated circuit packages with asymmetric adhesion material regionsINTEL CORP·Filed 2019·Granted Jun 20, 2023·3 cites·20 claims
- 0369US2024332112A1Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 0451US11798861B2Integrated heat spreader (IHS) with heating elementINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·20 claims
- 0549US11652061B2Package-level backside metallization (BSM)INTEL CORP·Filed 2019·Granted May 16, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →