Inventor · disambiguated record
Shaw-Tzeng Hsia
Also filed as: HSIA SHAW-TZENG
11 granted patents·506 citations·filing 1992–2018
93Inventor score
Top patents by PatentIndex Score
11 records- 0185US5393708AInter-metal-dielectric planarization processIND TECH RES INST·Filed 1992·Granted Feb 28, 1995·97 cites·20 claims
- 0283US5286675ABlanket tungsten etchback process using disposable spin-on-glassIND TECH RES INST·Filed 1993·Granted Feb 15, 1994·80 cites·25 claims
- 0381US5356836AAluminum plug processIND TECH RES INST·Filed 1993·Granted Oct 18, 1994·70 cites·29 claims
- 0474US5250472ASpin-on-glass integration planarization having siloxane partial etchback and silicate processesIND TECH RES INST·Filed 1992·Granted Oct 5, 1993·58 cites·12 claims
- 0571US10609300B2Image sensor, operation method thereof, and imaging deviceHUAIAN IMAGING DEVICE MFT CORP·Filed 2018·Granted Mar 31, 2020·2 cites·20 claims
- 0670US5552340ANitridation of titanium, for use with tungsten filled contact holesVANGUARD INT SEMICONDUCT CORP·Filed 1995·Granted Sep 3, 1996·33 cites·25 claims
- 0768US5849640AIn-situ SOG etchback and deposition for IMD processVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Dec 15, 1998·38 cites·21 claims
- 0867US5591672AAnnealing of titanium - titanium nitride in contact holeVANGUARD INT SEMICONDUCT CORP·Filed 1995·Granted Jan 7, 1997·38 cites·26 claims
- 0966US5705442AOptimized tungsten contact plug process via use of furnace annealed barrier layersVANGUARD INT SEMICONDUCT CORP·Filed 1995·Granted Jan 6, 1998·35 cites·22 claims
- 1062US5461010ATwo step etch back spin-on-glass process for semiconductor planarizationIND TECH RES INST·Filed 1994·Granted Oct 24, 1995·34 cites·19 claims
- 1150US5366850ASubmicron planarization process with passivation on metal lineIND TECH RES INST·Filed 1993·Granted Nov 22, 1994·21 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →