Inventor · disambiguated record

Shu-Wei Hsiao

Also filed as: HSIAO SHU-WEI

1 granted patent·1 pending application·4 citations·filing 2013–2024

24Inventor score

Technology areasH05K H10W

Files withMEDIATEK INC2

Top patents by PatentIndex Score

2 records

0164US9554453B2Printed circuit board structure with heat dissipation functionMEDIATEK INC·Filed 2013·Granted Jan 24, 2017·4 cites·18 claims
0251US2024304534A1Thermally improved substrate structure and package assembly with the sameMEDIATEK INC·Filed 2024·Application pending·0 cites

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Shu-Wei Hsiao — Patent Inventor | PatentIndex