Inventor · disambiguated record
Shou-Chian Hsu
Also filed as: HSU SHOU-CHIAN
13 granted patents·10 pending applications·50 citations·filing 2011–2024
90Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC16POWERTECH TECHNOLOGY INC4HSU SHOU-CHIAN1LIN CHANG-CHIH1MACROTECH TECHNOLOGY INC1
Top patents by PatentIndex Score
23 records- 0197US11756973B2Anti-flare semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 12, 2023·6 cites·20 claims
- 0296US12051711B2Anti-flare semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 30, 2024·4 cites·20 claims
- 0393US11063078B2Anti-flare semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 13, 2021·6 cites·13 claims
- 0492US9099364B1MPS-C2 semiconductor device having shorter supporting postsPOWERTECH TECHNOLOGY INC·Filed 2014·Granted Aug 4, 2015·18 cites·11 claims
- 0587US12396280B2Anti-flare semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 0686US2024429255A1Anti-flare semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0783US12107102B2Anti-flare semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0882US9419033B2Chip scale package of image sensor having dam combinationPOWERTECH TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·9 cites·8 claims
- 0980US11276724B2Electrical interconnection of image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 15, 2022·2 cites·9 claims
- 1078US11342375B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted May 24, 2022·2 cites·4 claims
- 1177US2024313021A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1274US2024047498A1Electrical interconnection of image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1373US12034028B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 1473US11830903B2Electrical interconnection of image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 1562US9553036B1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Jan 24, 2017·1 cites·15 claims
- 1659US8980694B2Fabricating method of MPS-C2 package utilized form a flip-chip carrierHSU SHOU-CHIAN·Filed 2011·Granted Mar 17, 2015·2 cites·5 claims
- 1758US2025015117A1Pads for image sensors and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1853US2023395633A1Image sensor packaging structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 1945US2017084513A1Semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 2042US2020411580A1Method of manufacturing ciscsp without damSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Application pending·0 cites
- 2139US2015048499A1Fine-pitch pillar bump layout structure on chipMACROTECH TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 2238US2019006531A1CISCSP Package and Related MethodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
- 2329US2012052630A1Method for manufacturing chip packageLIN CHANG-CHIH·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →