Inventor · disambiguated record
Shi-Sheng Hu
Also filed as: Hu shi-sheng
2 granted patents·9 pending applications·0 citations·filing 2022–2025
28Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11
Top patents by PatentIndex Score
11 records- 0178US2025366014A1Heterostructure channel layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0276US2025359216A1Semiconductor structure with air spacer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0374US2025359151A1Source/Drain Structure with Bottom InsulationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0469US2025280585A1Semiconductor structure with metal ion capture layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0568US2025331230A1Source/Drain Structure with Bottom InsulationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0665US12490453B2Heterostructure channel layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 0765US12336256B2Semiconductor structure with metal ion capture layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 0865US2025015132A1Semiconductor structure with air spacer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0959US2025338558A1Integrated circuit with ion implantation in ildTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1052US2025081511A1Field effect transistor having segmented channel regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1152US2025015167A1Multi-gate device and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shi-Sheng Hu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →