Inventor · disambiguated record
Shin-Yi Huang
Also filed as: HUANG SHIN-YI
18 granted patents·4 pending applications·427 citations·filing 2012–2023
93Inventor score
Top patents by PatentIndex Score
22 records- 0198USD760791SAnimated graphical user interface for a display screen or portion thereofYAHOO INC·Filed 2014·Granted Jul 5, 2016·153 cites·1 claims
- 0298USD760792SAnimated graphical user interface for a display screen or portion thereofYAHOO INC·Filed 2014·Granted Jul 5, 2016·139 cites·1 claims
- 0395US10296167B2Systems and methods for displaying an expanding menu via a user interfaceOATH INC·Filed 2014·Granted May 21, 2019·36 cites·18 claims
- 0488US9971756B2Systems and methods for delivering task-oriented contentOATH INC·Filed 2014·Granted May 15, 2018·10 cites·16 claims
- 0588USD775183SDisplay screen with transitional graphical user interface for a content digestYAHOO INC·Filed 2014·Granted Dec 27, 2016·40 cites·1 claims
- 0687US11424190B2Multi-chip package and manufacture method thereofIND TECH RES INST·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
- 0786US11251174B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 15, 2022·2 cites·16 claims
- 0886US8866309B2Chip package structureIND TECH RES INST·Filed 2012·Granted Oct 21, 2014·9 cites·21 claims
- 0976USD761833SDisplay screen with graphical user interface of a menu for a news digestYAHOO INC·Filed 2014·Granted Jul 19, 2016·20 cites·1 claims
- 1074USD867390SDisplay screen with transitional graphical user interface for a content digestOATH INC·Filed 2016·Granted Nov 19, 2019·15 cites·1 claims
- 1170US11569217B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2022·Granted Jan 31, 2023·0 cites·3 claims
- 1270US10490473B2Chip package module and circuit board structure comprising the sameIND TECH RES INST·Filed 2018·Granted Nov 26, 2019·1 cites·19 claims
- 1367US12074137B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2023·Granted Aug 27, 2024·0 cites·11 claims
- 1458US11587905B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 21, 2023·0 cites·8 claims
- 1554US11646270B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted May 9, 2023·0 cites·20 claims
- 1654US2025072032A1Semiconductor power deviceIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1748US11941178B2Electronic device and control method thereofASUSTEK COMP INC·Filed 2021·Granted Mar 26, 2024·0 cites·8 claims
- 1848US9143243B2Power module for high/low voltage insulationIND TECH RES INST·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
- 1944US2020083332A1Semiconductor device and method for fabricating the sameIND TECH RES INST·Filed 2019·Application pending·0 cites
- 2041US2013033747A1Three dimensional display panel and phase retardation film thereofBENQ MATERIALS CORP·Filed 2012·Application pending·0 cites
- 2137US2013043599A1Chip package process and chip package structureIND TECH RES INST·Filed 2012·Application pending·0 cites
- 2235US9492399B2Method of treating iron deficiencyIND TECH RES INST·Filed 2015·Granted Nov 15, 2016·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →