Inventor · disambiguated record
Sheng-Fu Huang
Also filed as: HUANG SHENG F · HUANG SHENG-FU
12 granted patents·7 pending applications·47 citations·filing 1990–2025
86Inventor score
Top patents by PatentIndex Score
19 records- 0195US11387207B2Method for fabricating semiconductor device including etching an edge portion of a bonding layer by using an etching maskNANYA TECHNOLOGY CORP·Filed 2020·Granted Jul 12, 2022·5 cites·8 claims
- 0291US12456703B2Semiconductor device structure including a bonding structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Oct 28, 2025·1 cites·20 claims
- 0384US10991828B2Semiconductor structure and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Apr 27, 2021·3 cites·4 claims
- 0476US2025329677A1Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0570US12482775B2Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Nov 25, 2025·0 cites·12 claims
- 0670US2024153902A1Semiconductor device structure including a bonding structureNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0769US2025343133A1Method for forming semiconductor interconnection structureNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0865US11742242B2Method for manufacturing through-silicon via with linerNANYA TECHNOLOGY CORP·Filed 2022·Granted Aug 29, 2023·0 cites·4 claims
- 0964US12308310B2Method for forming semiconductor interconnection structure against stress migrationNANYA TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·0 cites·12 claims
- 1063US11610996B2Semiconductor structure and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Mar 21, 2023·0 cites·8 claims
- 1159US11289370B2Liner for through-silicon viaNANYA TECHNOLOGY CORP·Filed 2020·Granted Mar 29, 2022·0 cites·4 claims
- 1259US2025248126A1Three dimensional semiconductor structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1359US2025259949A1Semiconductor device and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1455US11217525B1Semiconductor structure and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Jan 4, 2022·0 cites·19 claims
- 1550US2023317452A1Hard mask structureNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1648US11383195B2Device for capturing particlesIND TECH RES INST·Filed 2020·Granted Jul 12, 2022·0 cites·15 claims
- 1746US5193565ARib linkage jointTOTES INC·Filed 1991·Granted Mar 16, 1993·17 cites·1 claims
- 1846US5020558AAutomatic umbrella having stable extending and folding structureHUANG SHENG FU·Filed 1990·Granted Jun 4, 1991·21 cites·6 claims
- 1943US2021043545A1Semiconductor device and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →