Inventor · disambiguated record
Sheng-Che Huang
Also filed as: HUANG SHENG · HUANG SHENG CHE
11 granted patents·9 pending applications·26 citations·filing 2009–2025
84Inventor score
Files withASTI GLOBAL INC TAIWAN5MICRAFT SYSTEM PLUS CO LTD3SILICONWARE PRECISION INDUSTRIES CO LTD2SKIILEUX ELECTRICITY INC2STROKE PREC ADVANCED ENGINEERING CO LTD2
Top patents by PatentIndex Score
20 records- 0187US11973054B2Method for transferring electronic deviceSTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2022·Granted Apr 30, 2024·4 cites·7 claims
- 0277US7928868B1Entropy decoding deviceHON HAI PREC IND CO LTD·Filed 2009·Granted Apr 19, 2011·12 cites·9 claims
- 0376US8243816B2Entropy decoding methodTUNG YI-SHIN·Filed 2009·Granted Aug 14, 2012·8 cites·9 claims
- 0470US12224263B2Method for transferring electronic deviceMICRAFT SYSTEM PLUS CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·7 claims
- 0557US9867303B1Modular circuit deviceCUBEXUS LTD·Filed 2016·Granted Jan 9, 2018·1 cites·13 claims
- 0656US9516756B2Circuit module systemEZEK LAB COMPANY LTD·Filed 2014·Granted Dec 6, 2016·1 cites·12 claims
- 0751US2023113328A1Device and method for removing electronic component and method for manufacturing led panelASTI GLOBAL INC TAIWAN·Filed 2022·Application pending·0 cites
- 0850US9899235B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·12 claims
- 0950US2015144384A1Packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1049US2022209082A1Method for transferring chips and method for manufacturing led displayASTI GLOBAL INC TAIWAN·Filed 2021·Application pending·0 cites
- 1149US2024203934A1Apparatus for bonding electronic component, method for bonding electronic component, and method for manufacturing light-emitting diode displaySTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 1248US12125719B2Chip-transferring system and chip-transferring methodSKIILEUX ELECTRICITY INC·Filed 2021·Granted Oct 22, 2024·0 cites·9 claims
- 1348US2022223460A1Transferring apparatus and method for transferring electronic componentASTI GLOBAL INC TAIWAN·Filed 2021·Application pending·0 cites
- 1448US2025338684A1Method for removing electronic component from substrate and method for manufacturing light emitting diode displayMICRAFT SYSTEM PLUS CO LTD·Filed 2025·Application pending·0 cites
- 1547US12261071B2Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panelASTI GLOBAL INC TAIWAN·Filed 2022·Granted Mar 25, 2025·0 cites·11 claims
- 1646US2022020723A1Chip-carrying structure and chip-bonding methodSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1745US12394642B2Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panelMICRAFT SYSTEM PLUS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·4 claims
- 1844US2022359253A1Electronic component transferring apparatus, electronic component transferring method and manufacturing method of light-emitting diode panelASTI GLOBAL INC TAIWAN·Filed 2022·Application pending·0 cites
- 1943US8284840B2Video decoding device and methodTSAI HSIEH-FU·Filed 2009·Granted Oct 9, 2012·0 cites·18 claims
- 2034US2024151470A1Transfer apparatus and methodGUANGDONG LYRIC ROBOT AUTOMATION CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →