Inventor · disambiguated record
Shan-Yu Huang
Also filed as: HUANG SHAN-YU
8 granted patents·9 pending applications·0 citations·filing 2021–2025
74Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17
Top patents by PatentIndex Score
17 records- 0181US2025329678A1Chip structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0279US2025300028A1Dummy Patterns in Redundant Region of Double Seal RingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0376US12341071B2Dummy patterns in redundant region of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·19 claims
- 0476US2025349758A1Wafer Level Multi-Die Structure FormationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0576US2025349634A1Forming Structures In Empty Regions On Wafers With Dual Seal Ring StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0675US12417992B2Chip structure with conductive pillar and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 0772US2025329536A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0870US2025266374A1Semiconductor device having functional patterns in redundant regions of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0969US11728229B2Dummy patterns in redundant region of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1069US11688708B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 1169US2025300099A1Mandrel Fin Design For Double Seal RingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1265US12412746B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 1364US12300635B2Semiconductor device having functional patterns in redundant regions of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1463US12341113B2Mandrel fin design for double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1563US2023402406A1Wafer Level Multi-Die Structure FormationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1662US2023402335A1Forming Structures In Empty Regions On Wafers With Dual Seal Ring StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1758US11855010B2Semiconductor structure and method for forming features in redundant region of double seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →