Inventor · disambiguated record
Shaowu Huang
Also filed as: HUANG SHAOWU
60 granted patents·18 pending applications·1,169 citations·filing 2014–2025
98Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC13INTEL CORP13MARVELL ASIA PTE LTD13INVENSAS BONDING TECH INC12INVENSAS CORP12
Top patents by PatentIndex Score
78 records- 0198US11860415B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jan 2, 2024·9 cites·17 claims
- 0298US11600542B2Cavity packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Mar 7, 2023·6 cites·23 claims
- 0398US11355443B2Dielets on flexible and stretchable packaging for microelectronicsINVENSAS CORP·Filed 2019·Granted Jun 7, 2022·144 cites·9 claims
- 0498US11296044B2Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processesINVENSAS BONDING TECH INC·Filed 2019·Granted Apr 5, 2022·80 cites·24 claims
- 0598US11169326B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsINVENSAS BONDING TECH INC·Filed 2019·Granted Nov 9, 2021·60 cites·22 claims
- 0698US10923408B2Cavity packagesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 16, 2021·133 cites·17 claims
- 0798US10784191B2Interface structures and methods for forming sameINVENSAS BONDING TECH INC·Filed 2018·Granted Sep 22, 2020·123 cites·24 claims
- 0898US10522352B2Direct-bonded native interconnects and active base dieXCELSIS CORP·Filed 2017·Granted Dec 31, 2019·20 cites·23 claims
- 0998US10508030B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 17, 2019·124 cites·14 claims
- 1098US10446487B2Interface structures and methods for forming sameINVENSAS BONDING TECH INC·Filed 2017·Granted Oct 15, 2019·151 cites·28 claims
- 1197US11626363B2Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2017·Granted Apr 11, 2023·16 cites·25 claims
- 1297US10276909B2Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed thereinINVENSAS BONDING TECH INC·Filed 2016·Granted Apr 30, 2019·188 cites·23 claims
- 1396US12057383B2Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Aug 6, 2024·3 cites·31 claims
- 1496US11823906B2Direct-bonded native interconnects and active base dieADEIA SEMICONDUCTOR INC·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 1596US11257727B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2019·Granted Feb 22, 2022·9 cites·20 claims
- 1696US10832912B2Direct-bonded native interconnects and active base dieXCELSIS CORP·Filed 2019·Granted Nov 10, 2020·10 cites·20 claims
- 1796US9935075B2Wire bonding method and apparatus for electromagnetic interference shieldingINVENSAS CORP·Filed 2016·Granted Apr 3, 2018·16 cites·20 claims
- 1895US11417576B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2019·Granted Aug 16, 2022·7 cites·19 claims
- 1995US9496633B1Memory module adaptor cardINTEL CORP·Filed 2015·Granted Nov 15, 2016·18 cites·21 claims
- 2092US12322667B2Seal for microelectronic assemblyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jun 3, 2025·1 cites·14 claims
- 2192US10658302B2Wire bonding method and apparatus for electromagnetic interference shieldingINVENSAS CORP·Filed 2018·Granted May 19, 2020·5 cites·16 claims
- 2291US11765822B1Printed circuit boards with meshed conductive structuresMARVELL ASIA PTE LTD·Filed 2021·Granted Sep 19, 2023·2 cites·17 claims
- 2391US2025343086A1Seal for microelectronic assemblyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 2489US11967575B2Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 23, 2024·1 cites·20 claims
- 2589US10299368B2Surface integrated waveguides and circuit structures thereforINVENSAS CORP·Filed 2016·Granted May 21, 2019·7 cites·12 claims
- 2688US10403577B1Dielets on flexible and stretchable packaging for microelectronicsINVENSAS CORP·Filed 2018·Granted Sep 3, 2019·4 cites·16 claims
- 2786US10109903B2Flipped RF filters and componentsINVENSAS CORP·Filed 2016·Granted Oct 23, 2018·4 cites·12 claims
- 2885US12362182B2Direct-bonded native interconnects and active base dieADEIA SEMICONDUCTOR INC·Filed 2023·Granted Jul 15, 2025·0 cites·19 claims
- 2985US11289333B2Direct-bonded native interconnects and active base dieXCELSIS CORP·Filed 2020·Granted Mar 29, 2022·1 cites·26 claims
- 3084US12381119B2Seal for microelectronic assemblyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Aug 5, 2025·0 cites·24 claims
- 3184US12094835B2Wire bonding method and apparatus for electromagnetic interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Sep 17, 2024·0 cites·15 claims
- 3284US9716361B2Memory module adaptor cardINTEL CORP·Filed 2016·Granted Jul 25, 2017·3 cites·14 claims
- 3383US2025125248A1Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3482US12271032B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 8, 2025·0 cites·21 claims
- 3582US11570887B2On-board integrated enclosure for electromagnetic compatibility shieldingMARVELL ASIA PTE LTD·Filed 2021·Granted Jan 31, 2023·1 cites·18 claims
- 3682US10658313B2Selective recessINVENSAS BONDING TECH INC·Filed 2018·Granted May 19, 2020·3 cites·24 claims
- 3781US9946825B2Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function techniqueTSANG LEUNG W·Filed 2016·Granted Apr 17, 2018·4 cites·3 claims
- 3881US2025231341A1Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 3980US10535909B2Methods of forming flipped RF filter componentsINVENSAS CORP·Filed 2018·Granted Jan 14, 2020·2 cites·19 claims
- 4080US10149377B2Stacked transmission lineINVENSAS CORP·Filed 2016·Granted Dec 4, 2018·3 cites·23 claims
- 4178US11837556B2Wire bonding method and apparatus for electromagnetic interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Dec 5, 2023·0 cites·17 claims
- 4277US11369020B2Stacked transmission lineINVENSAS LLC·Filed 2018·Granted Jun 21, 2022·2 cites·18 claims
- 4376US9935353B2Printed circuit board having a signal conductor disposed adjacent one or more trenches filled with a low-loss ambient mediumINTEL CORP·Filed 2015·Granted Apr 3, 2018·2 cites·18 claims
- 4475US12317414B1Common-mode filtering for converting differential signaling to single-ended signalingMARVELL ASIA PTE LTD·Filed 2024·Granted May 27, 2025·0 cites·26 claims
- 4574US12028966B2Printed circuit board including on-board integrated enclosure for electromagnetic compatibility shieldingMARVELL ASIA PTE LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 4672US11335647B2Wire bonding method and apparatus for electromagnetic interference shieldingINVENSAS CORP·Filed 2020·Granted May 17, 2022·0 cites·18 claims
- 4772US9679854B2Reconfigurable repeater systemINTEL CORP·Filed 2015·Granted Jun 13, 2017·2 cites·15 claims
- 4872US2023260858A1Cavity packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Application pending·0 cites
- 4972US2023187398A1Bond enhancement for direct-bonding processesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Application pending·0 cites
- 5069US2022278048A1Dielets on flexible and stretchable packaging for microelectronicsINVENSAS CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →