Inventor · disambiguated record
Shih-Ting Hung
Also filed as: HUNG SHIH-TING
40 granted patents·7 pending applications·3,600 citations·filing 2008–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD33STRIKE IND INC7TAIWAN SEMICONDUCTOR MFG3HUNG SHIH-TING2CHANG CHENG-HUNG1
Top patents by PatentIndex Score
47 records- 0199US8048723B2Germanium FinFETs having dielectric punch-through stoppersTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 1, 2011·265 cites·17 claims
- 0298US11175108B1Modular bolt catch for firearmsSTRIKE IND INC·Filed 2020·Granted Nov 16, 2021·18 cites·20 claims
- 0398US9520482B1Method of cutting metal gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 13, 2016·3.2k cites·20 claims
- 0497US8263462B2Dielectric punch-through stoppers for forming FinFETs having dual fin heightsHUNG SHIH-TING·Filed 2008·Granted Sep 11, 2012·68 cites·11 claims
- 0596US8957477B2Germanium FinFETs having dielectric punch-through stoppersCHANG CHENG-HUNG·Filed 2011·Granted Feb 17, 2015·23 cites·17 claims
- 0695US11162758B1Adjustable multi-angle grip for firearmsSTRIKE IND INC·Filed 2021·Granted Nov 2, 2021·7 cites·20 claims
- 0794US9735042B2Dielectric punch-through stoppers for forming FinFETs having dual Fin heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
- 0893US11164754B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·9 cites·20 claims
- 0991US11175109B1Dual-finger operable safety selector for firearmsSTRIKE IND INC·Filed 2020·Granted Nov 16, 2021·5 cites·14 claims
- 1091US9048259B2Dielectric punch-through stoppers for forming FinFETs having dual fin heightsHUNG SHIH-TING·Filed 2012·Granted Jun 2, 2015·11 cites·19 claims
- 1189US10347574B2Integrated fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·5 cites·20 claims
- 1288US11248867B2Modular magazine release for firearmsSTRIKE IND INC·Filed 2020·Granted Feb 15, 2022·4 cites·9 claims
- 1386US12388028B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1484US12237262B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1584US11302650B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·20 claims
- 1684US2025105077A1Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1782US12308313B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 1882US12051654B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1982US9911805B2Silicon recess etch and epitaxial deposit for shallow trench isolation (STI)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·3 cites·20 claims
- 2082US2024387308A1Manufacturing method of package-on-package structure and manufacturing method of integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2181US11637054B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·20 claims
- 2281US2025079428A1Semiconductor Devices and Methods of ManufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2380US2024389239A1Methods and systems for improving surface mount joinderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2479US10879162B2Integrated fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·2 cites·15 claims
- 2579US9129823B2Silicon recess ETCH and epitaxial deposit for shallow trench isolation (STI)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 8, 2015·4 cites·20 claims
- 2677US11901279B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 2777US11804451B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 31, 2023·0 cites·20 claims
- 2877US11114311B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·20 claims
- 2977US2024178116A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3076US12176337B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 3175US12382587B2Methods and systems for improving surface mount joinderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 3275US11848265B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 3374US11901277B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 3473US12198996B2Integrated fan-out package, package-on-package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 3570US12320610B2Cover kit for firearm handguardLEE SHANYAO·Filed 2021·Granted Jun 3, 2025·1 cites·19 claims
- 3669US11430776B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 3763US2022352085A1Package structure with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3862US11094625B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 3959US11592261B2Adjustable multi-angle grip for firearmsSTRIKE IND INC·Filed 2021·Granted Feb 28, 2023·0 cites·11 claims
- 4058US11075132B2Integrated fan-out package, package-on-package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·0 cites·20 claims
- 4157US9831322B2Channel epitaxial regrowth flow (CRF)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·0 cites·20 claims
- 4257US9391203B2Channel epitaxial regrowth flow (CRF)TAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 12, 2016·0 cites·20 claims
- 4356US11430739B2Structure and formation method of package structure with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 30, 2022·0 cites·20 claims
- 4454US8927352B2Channel epitaxial regrowth flow (CRF)TAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 6, 2015·0 cites·20 claims
- 4553US2022072693A1Multi-Function Touch-Free ToolSTRIKE IND INC·Filed 2020·Application pending·0 cites
- 4651US9502533B2Silicon recess etch and epitaxial deposit for shallow trench isolation (STI)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 4740US11656051B2Bipod grip for firearmsSTRIKE IND INC·Filed 2020·Granted May 23, 2023·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →