Inventor · disambiguated record
Shoichi Iriguchi
Also filed as: IRIGUCHI SHOICHI
9 granted patents·5 pending applications·17 citations·filing 2013–2025
81Inventor score
Files withTEXAS INSTRUMENTS INC14
Top patents by PatentIndex Score
14 records- 0194US10658240B1Semiconductor die singulationTEXAS INSTRUMENTS INC·Filed 2019·Granted May 19, 2020·12 cites·26 claims
- 0271US12198982B2Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 14, 2025·0 cites·15 claims
- 0370US10763230B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·1 cites·8 claims
- 0469US8993412B1Method for reducing backside die damage during die separation processTEXAS INSTRUMENTS INC·Filed 2013·Granted Mar 31, 2015·3 cites·8 claims
- 0567US11171031B2Die matrix expander with partitioned subringTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 9, 2021·1 cites·20 claims
- 0667US2023260839A1Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0767US2025157858A1Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0865US11367699B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 21, 2022·0 cites·19 claims
- 0961US11482442B2Subring for semiconductor diesTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 25, 2022·0 cites·15 claims
- 1057US11469141B2Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 11, 2022·0 cites·7 claims
- 1155US11664276B2Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2018·Granted May 30, 2023·0 cites·18 claims
- 1255US2025079247A1Mold compound trenches to facilitate package singulationTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1348US2020075386A1Subring for semiconductor diesTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 1430US2017338184A1Method of dicing integrated circuit wafersTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →