Inventor · disambiguated record
Shousaku Ishihara
Also filed as: ISHIHARA SHOUSAKU
9 granted patents·1 pending application·133 citations·filing 1984–2004
89Inventor score
Top patents by PatentIndex Score
10 records- 0162US5925444AOrganic binder for shaping ceramic, its production method and product employing the sameHITACHI LTD·Filed 1996·Granted Jul 20, 1999·33 cites·4 claims
- 0262US4908696AConnector and semiconductor device packages employing the sameHITACHI LTD·Filed 1987·Granted Mar 13, 1990·30 cites·18 claims
- 0357US4576735AElectroconductive molybdenum pasteHITACHI LTD·Filed 1984·Granted Mar 18, 1986·14 cites·4 claims
- 0449US5825632ACircuit substrate and electronics computer, using sintered glass ceramicsHITACHI LTD·Filed 1995·Granted Oct 20, 1998·14 cites·18 claims
- 0547US6118671ACircuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computerHITACHI LTD·Filed 1998·Granted Sep 12, 2000·13 cites·44 claims
- 0647US5503787AMethod for manufacturing multilayer ceramic substrateHITACHI LTD·Filed 1994·Granted Apr 2, 1996·9 cites·14 claims
- 0745US4817276AProcess for producing ceramic substrates for microelectronic circuitsHITACHI LTD·Filed 1986·Granted Apr 4, 1989·7 cites·4 claims
- 0838US4734233ACeramic wiring substrate and process for producing the sameHITACHI LTD·Filed 1987·Granted Mar 29, 1988·9 cites·8 claims
- 0936US4935285ACeramic substrates for microelectronic circuits and process for producing sameHITACHI LTD·Filed 1988·Granted Jun 19, 1990·4 cites·4 claims
- 1036US2006239855A1Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structureNAKATSUKA TETSUYA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →