Inventor · disambiguated record
Shinsuke Ishikawa
Also filed as: ISHIKAWA SHINSUKE
3 granted patents·4 pending applications·3 citations·filing 2014–2023
53Inventor score
Top patents by PatentIndex Score
7 records- 0168US10368438B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Jul 30, 2019·2 cites·20 claims
- 0255US9578756B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Feb 21, 2017·1 cites·20 claims
- 0354US2025171470A1Compound, bonding agent, bonded body, printed circuit board, and method for manufacturing bonded bodyDAICEL CORP·Filed 2021·Application pending·0 cites
- 0449US2025034385A1Thermosetting resin composition, resin composition for printed wiring board, and resin composition for printed wiring board substrateDAICEL CORP·Filed 2023·Application pending·0 cites
- 0544US2015034365A1Method for manufacturing wiring board and wiring boardIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 0642US9591771B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Mar 7, 2017·0 cites·20 claims
- 0738US2020376720A1Method for producing mold, and method for producing molded article using sameDAICEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →