Inventor · disambiguated record
Shinji Ishitani
Also filed as: ISHITANI SHINJI
10 granted patents·5 pending applications·50 citations·filing 2004–2025
84Inventor score
Top patents by PatentIndex Score
15 records- 0190US7554126B2Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting devicePANASONIC CORP·Filed 2005·Granted Jun 30, 2009·25 cites·13 claims
- 0277US7692292B2Packaged electronic element and method of producing electronic element packagePANASONIC CORP·Filed 2004·Granted Apr 6, 2010·18 cites·5 claims
- 0371US2025121461A1Bonding material and bonded structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0471US2025282005A1Joining materialPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0565US8129739B2Semiconductor light emitting device and semiconductor light emitting device mounted boardHIGASHI KAZUSHI·Filed 2006·Granted Mar 6, 2012·4 cites·13 claims
- 0662US11318534B2Metal microparticle production method and metal microparticle production devicePANASONIC IP MAN CO LTD·Filed 2019·Granted May 3, 2022·0 cites·7 claims
- 0760US2025108463A1Bonding material and bonding structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0859US8077447B2Electronic element package and method of manufacturing the sameHIGASHI KAZUSHI·Filed 2007·Granted Dec 13, 2011·2 cites·3 claims
- 0955US8240539B2Joining apparatus with UV cleaningHIGASHI KAZUSHI·Filed 2005·Granted Aug 14, 2012·1 cites·1 claims
- 1055US2025286009A1Joining structure and joining material for forming joining part of said joining structurePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 1151US11515281B2Bonded structure and bonding materialPANASONIC CORP·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 1248US11011319B2Electronic componentPANASONIC IP MAN CO LTD·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1347US7550715B2Fast atom bombardment source, fast atom beam emission method, and surface modification apparatusPANASONIC CORP·Filed 2007·Granted Jun 23, 2009·0 cites·9 claims
- 1442US2017341188A1Solder materialPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 1539US7646095B2Semiconductor devicePANASONIC CORP·Filed 2004·Granted Jan 12, 2010·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →