Inventor · disambiguated record
Shinya Ishiwata
Also filed as: ISHIWATA SHINYA
1 granted patent·4 pending applications·0 citations·filing 2018–2023
11Inventor score
Files withADEKA CORP5
Top patents by PatentIndex Score
5 records- 0156US11624120B2Additive for electrolytic plating solutions, electrolytic plating solution containing additive for electrolytic plating solutions, and electrolytic plating method using electrolytic plating solutionADEKA CORP·Filed 2018·Granted Apr 11, 2023·0 cites·4 claims
- 0256US2025354268A1Composition, method for producing composition, and method for producing silver filmADEKA CORP·Filed 2023·Application pending·0 cites
- 0349US2024132453A1Additive for electroplating solution, electroplating solution, electroplating method, and method of producing metal layerADEKA CORP·Filed 2022·Application pending·0 cites
- 0445US2023025950A1Copper electroplating solution, method of producing same, and copper electroplating methodADEKA CORP·Filed 2020·Application pending·0 cites
- 0543US2022220065A1Additive for electroplating solutions, electroplating solution, electroplating method and novel compoundADEKA CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →