Inventor · disambiguated record
Shintaro Ishiyama
Also filed as: ISHIYAMA SHINTARO
8 granted patents·2 pending applications·38 citations·filing 1991–2019
83Inventor score
Files withJAPAN ATOMIC ENERGY RES INST4TOSHIBA KK2ISHIYAMA SHINTARO1JAPAN SCIENCE & TECH AGENCY1TOKYO INST TECH1
Top patents by PatentIndex Score
10 records- 0187US7981168B2Compact heat exchanger made of ceramics having corrosion resistance at high temperatureJAPAN ATOMIC ENERGY RES INST·Filed 2008·Granted Jul 19, 2011·10 cites·1 claims
- 0277US7168481B2Compact heat exchanger made of ceramics having corrosion resistance at high temperatureTOSHIBA KK·Filed 2004·Granted Jan 30, 2007·15 cites·2 claims
- 0361US11267720B2Method for manufacturing electride of mayenite-type compoundsTOKYO INST TECH·Filed 2017·Granted Mar 8, 2022·0 cites·5 claims
- 0456US2007107888A1Compact heat exchanger made of ceramics having corrosion resistance at high temperatureTOSHIBA KK·Filed 2006·Application pending·0 cites
- 0555US11946151B2Electrolytic cell and electrolytic deviceJAPAN SCIENCE & TECH AGENCY·Filed 2019·Granted Apr 2, 2024·0 cites·8 claims
- 0645US2021138274A1Accumulative boron 10 medicine for boron neutron capture therapy for selectively or locally targeting tumor tissues in short timeUNIV HIROSAKI·Filed 2019·Application pending·0 cites
- 0736US5698006ANickel-aluminum intermetallic compounds containing dopant elementsJAPAN ATOMIC ENERGY RES INST·Filed 1996·Granted Dec 16, 1997·4 cites·4 claims
- 0836US5244609AProcess for preparing an impermeable carbon fiber reinforcing type of composite materialJAPAN ATOMIC ENERGY RES INST·Filed 1991·Granted Sep 14, 1993·8 cites·14 claims
- 0934US8236674B2Substrate processing method and semiconductor device manufacturing method including a proton injection step and a laser irradiation stepISHIYAMA SHINTARO·Filed 2010·Granted Aug 7, 2012·0 cites·5 claims
- 1029US5765096AMethod for producing nickel-aluminum intermetallic compounds containing dopant elementsJAPAN ATOMIC ENERGY RES INST·Filed 1997·Granted Jun 9, 1998·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →