Inventor · disambiguated record
Shin-Dar Jan
Also filed as: JAN SHIN-DAR
10 granted patents·2 pending applications·9 citations·filing 2012–2018
80Inventor score
Top patents by PatentIndex Score
12 records- 0182US10573776B2Manufacturing method of image-sensing moduleLUXVISIONS INNOVATION LTD·Filed 2018·Granted Feb 25, 2020·4 cites·10 claims
- 0268US9161449B2Image sensor module having flat material between circuit board and image sensing chipLARVIEW TECHNOLOGIES CORP·Filed 2013·Granted Oct 13, 2015·2 cites·12 claims
- 0362US9154675B2Image capturing module for reducing assembly tilt angleLARVIEW TECHNOLOGIES CORP·Filed 2013·Granted Oct 6, 2015·1 cites·5 claims
- 0460US8809984B2Substrate connection type module structureJAN SHIN-DAR·Filed 2012·Granted Aug 19, 2014·2 cites·16 claims
- 0549US2014035079A1Window Type Camera Module StructureJAN SHIN-DAR·Filed 2012·Application pending·0 cites
- 0648US8866246B2Holder on chip module structureLARVIEW TECHNOLOGIES CORP·Filed 2012·Granted Oct 21, 2014·0 cites·16 claims
- 0748US8816414B2Module structure with partial pierced substrateLARVIEW TECHNOLOGIES CORP·Filed 2012·Granted Aug 26, 2014·0 cites·18 claims
- 0845US9128223B2Method of aligning and assembling an image capturing moduleLARVIEW TECHNOLOGIES CORP·Filed 2013·Granted Sep 8, 2015·0 cites·10 claims
- 0945US8872296B2Chip module structure for particles protectionLARVIEW TECHNOLOGIES CORP·Filed 2012·Granted Oct 28, 2014·0 cites·18 claims
- 1042US9158089B2Optical image capturing module and method of manufacturing the same, and optical auxiliary unitLARVIEW TECHNOLOGIES CORP·Filed 2014·Granted Oct 13, 2015·0 cites·15 claims
- 1135US8901693B2Substrate inside type module structureJAN SHIN-DAR·Filed 2012·Granted Dec 2, 2014·0 cites·5 claims
- 1234US2014035165A1Pierced Substrate on Chip Module StructureJAN SHIN-DAR·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →