Inventor · disambiguated record
Shin-Pu Jeng
Also filed as: JENG SHIN-PU
1 granted patent·1 pending application·14 citations·filing 1999–2022
36Inventor score
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2 records- 0147US2023137691A1Hybrid organic and non-organic interposer with embedded component in molding structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0243US6300240B1Method for forming bottom anti-reflective coating (BARC)WORLDWIDE SEMICONDUCTOR MFG·Filed 1999·Granted Oct 9, 2001·14 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →