Inventor · disambiguated record
Shingo Kaimori
Also filed as: KAIMORI SHINGO
9 granted patents·19 pending applications·13 citations·filing 2002–2022
81Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES12KAIMORI SHINGO8HOSOYA TOSHIFUMI2NAKAMURA HIDEAKI2NAT INST OF ADVANCED IND SCIEN2
Top patents by PatentIndex Score
28 records- 0180US9343653B2Piezoelectric element including fluororesin filmSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Granted May 17, 2016·2 cites·11 claims
- 0279US10485102B2Substrate for high-frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Nov 19, 2019·2 cites·8 claims
- 0372USRE49929ESubstrate for high-frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Apr 16, 2024·1 cites·8 claims
- 0466US8012321B2Biosensor chip, biosensor system and measuring instrument thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Sep 6, 2011·2 cites·21 claims
- 0563US12213249B2Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Jan 28, 2025·0 cites·9 claims
- 0663US8282813B2Biosensor measurement machine, biosensor measurement system and biosensor measurement methodKAIMORI SHINGO·Filed 2006·Granted Oct 9, 2012·2 cites·6 claims
- 0752US2009020420A1Biosensor Chip and Biosensor Chip Production MethodSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Application pending·0 cites
- 0850US2024422902A1Dielectric sheet, substrate for high frequency printed wiring board, and high frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Application pending·0 cites
- 0950US2009123335A1Sensor Chip and Sensor SystemNAKAMURA HIDEAKI·Filed 2006·Application pending·0 cites
- 1050US2016107376A1Metal-resin composite body, wiring material, and method for producing metal-resin composite bodySUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Application pending·0 cites
- 1148US10244626B2Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Granted Mar 26, 2019·0 cites·11 claims
- 1247US2010069792A1Biosensor cartridge, biosensor device, sample collecting method, manufacturing method of biosensor cartridge, and needle integral sensorNAT INST OF ADVANCED IND SCIEN·Filed 2007·Application pending·0 cites
- 1347US2010228149A1Sensor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2008·Application pending·0 cites
- 1447US2010004559A1Biosensor cartridge, method of using biosensor cartridge, biosensor device, and needle integral sensorNAT INST OF ADVANCED IND SCIEN·Filed 2007·Application pending·0 cites
- 1545US6783921B2Method for etching laminated assembly including polyimide layerSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Aug 31, 2004·4 cites·7 claims
- 1645US2009299225A1Biosensor chipSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Application pending·0 cites
- 1744US2009053105A1Sensor ChipHOSOYA TOSHIFUMI·Filed 2006·Application pending·0 cites
- 1842US2008248457A1Sensor Chip and Manufacturing Method ThereofHOSOYA TOSHIFUMI·Filed 2005·Application pending·0 cites
- 1940US2008129280A1Coupled Member Made of a Plurality of Sensor Chips and Manufacturing Method ThereofKAIMORI SHINGO·Filed 2006·Application pending·0 cites
- 2039US2009050986A1Method for Fabricating Sensor Chip, and Sensor ChipKAIMORI SHINGO·Filed 2006·Application pending·0 cites
- 2138US2009257917A1Sensor Chip and Sensor Chip Production MethodNAKAMURA HIDEAKI·Filed 2006·Application pending·0 cites
- 2236US2012048598A1Adhesive resin composition, and laminate and flexible printed wiring board using the sameKAIMORI SHINGO·Filed 2010·Application pending·0 cites
- 2336US2011303439A1Adhesive resin compositions, and laminates and flexible printed wiring boards using sameKAIMORI SHINGO·Filed 2010·Application pending·0 cites
- 2434US2004245320A1Bonding wireFiled 2002·Application pending·0 cites
- 2533US2007235887A1Bonding Wire and Integrated Circuit Device Using the SameKAIMORI SHINGO·Filed 2004·Application pending·0 cites
- 2632US9181464B2Adhesive resin compositions, and laminates and flexible printed wiring boards using sameKAIMORI SHINGO·Filed 2010·Granted Nov 10, 2015·0 cites·5 claims
- 2731US2012043118A1Adhesive resin composition, and laminate and flexible printed wiring board using the sameKAIMORI SHINGO·Filed 2010·Application pending·0 cites
- 2830US2005151253A1Bonding wire and an integrated circuit device using the sameSUMITOMO ELECTRIC WINTEC INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →