Inventor · disambiguated record
Shinji Kanayama
Also filed as: KANAYAMA SHINJI
47 granted patents·3 pending applications·1,133 citations·filing 1993–2008
98Inventor score
Top patents by PatentIndex Score
50 records- 0197US7797820B2Component mounting apparatusPANASONIC CORP·Filed 2008·Granted Sep 21, 2010·178 cites·7 claims
- 0296US7353596B2Component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 8, 2008·180 cites·4 claims
- 0395US5894657AMounting apparatus for electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Apr 20, 1999·142 cites·9 claims
- 0488US7827677B2Component mounting apparatusPANASONIC CORP·Filed 2005·Granted Nov 9, 2010·15 cites·2 claims
- 0585US6706130B1Method and device for frictional connection and holding tool used for the frictional connection deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 16, 2004·31 cites·24 claims
- 0685US6017812ABump bonding method and bump bonding apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jan 25, 2000·82 cites·3 claims
- 0782US7020953B2Apparatus and method for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 4, 2006·30 cites·10 claims
- 0879US6467670B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 22, 2002·19 cites·18 claims
- 0977US7014092B2Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 21, 2006·16 cites·9 claims
- 1077US6193136B1Component mounting method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 27, 2001·32 cites·23 claims
- 1176US6302317B1Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 16, 2001·28 cites·6 claims
- 1275US7219419B2Component mounting apparatus including a polishing deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 22, 2007·15 cites·22 claims
- 1374US7549567B2Component mounting tool, and method and apparatus for mounting component using this toolPANASONIC CORP·Filed 2007·Granted Jun 23, 2009·6 cites·17 claims
- 1473US5783915ALinear actuating apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 21, 1998·38 cites·10 claims
- 1572US6692214B1Pusher, puller loader, unloader, and working deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 17, 2004·17 cites·20 claims
- 1672US6329640B1Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 11, 2001·13 cites·16 claims
- 1770US6506222B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 14, 2003·11 cites·13 claims
- 1870US5854745AMethod and apparatus for mounting electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Dec 29, 1998·42 cites·14 claims
- 1969US7516878B2Bump formation method and bump forming apparatus for semiconductor waferPANASONIC CORP·Filed 2005·Granted Apr 14, 2009·2 cites·6 claims
- 2069US7021357B2Component mounting apparatus and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 4, 2006·13 cites·8 claims
- 2169US6494358B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 17, 2002·10 cites·7 claims
- 2265US6467158B1Component feeder with load position alignment recognitionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 22, 2002·26 cites·1 claims
- 2363US6910613B2Device and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 28, 2005·8 cites·12 claims
- 2463US6332268B1Method and apparatus for packaging IC chip, and tape-shaped carrier to be used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 25, 2001·21 cites·38 claims
- 2562US6830989B1Method and apparatus for handling arrayed partMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 14, 2004·7 cites·8 claims
- 2660US7350684B2Apparatus and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 1, 2008·2 cites·13 claims
- 2760US6568580B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 27, 2003·6 cites·2 claims
- 2859US7220922B2Electronic component, component mounting equipment, and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 22, 2007·12 cites·20 claims
- 2959US7052984B2Bump formation method and bump forming apparatus for semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 30, 2006·6 cites·24 claims
- 3058US6439447B1Bump joining judging device and method, and semiconductor component production device and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 27, 2002·23 cites·40 claims
- 3156US7387229B2Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 17, 2008·4 cites·7 claims
- 3254US7005368B1Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 28, 2006·3 cites·8 claims
- 3354US2008179378A1Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeIMANISHI MAKOTO·Filed 2007·Application pending·0 cites
- 3453US6392202B2Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 21, 2002·3 cites·4 claims
- 3550US6647616B1Bump bonding unit with tray storage and transport apparatusesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 18, 2003·17 cites·3 claims
- 3650US6572005B2Bump-joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 3, 2003·3 cites·6 claims
- 3749US7861908B2Component mounting method, component mounting apparatus, and ultrasonic bonding headPANASONIC CORP·Filed 2007·Granted Jan 4, 2011·0 cites·14 claims
- 3848US5462626AMethod of bonding an external lead and a tool thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Oct 31, 1995·13 cites·14 claims
- 3947US7031509B2Method and apparatus for correcting inclination of IC on semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 18, 2006·2 cites·15 claims
- 4047US6055724AMethod and device for sealing IC chipMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted May 2, 2000·13 cites·11 claims
- 4145US6619535B1Working method for holding a work object by suctionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 16, 2003·13 cites·10 claims
- 4243US2004183910A1Method and apparatus for handling arrayed componentsFiled 2004·Application pending·0 cites
- 4342US6321973B1Bump joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 27, 2001·8 cites·2 claims
- 4441US6264704B1Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 24, 2001·7 cites·14 claims
- 4540US7229854B2Electronic component mounting method and apparatus and ultrasonic bonding headMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 12, 2007·0 cites·7 claims
- 4640US6818975B1Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 16, 2004·0 cites·29 claims
- 4740US2003205607A1Bump joining methodFiled 2003·Application pending·0 cites
- 4836US6129203AIC discarding apparatus for flip chip mounting facilityMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Oct 10, 2000·7 cites·6 claims
- 4935US5582341ABonding apparatus for terminal componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Dec 10, 1996·6 cites·4 claims
- 5034US6787391B1Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 7, 2004·3 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →