Inventor · disambiguated record
Shuuichi Kariyazaki
Also filed as: KARIYAZAKI SHUUICHI
35 granted patents·6 pending applications·302 citations·filing 2002–2024
96Inventor score
Top patents by PatentIndex Score
41 records- 0197US10937753B1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Mar 2, 2021·6 cites·14 claims
- 0297US6650014B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted Nov 18, 2003·200 cites·16 claims
- 0395US10325841B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 18, 2019·19 cites·15 claims
- 0492US9917026B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 13, 2018·13 cites·20 claims
- 0591US10163791B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 25, 2018·8 cites·14 claims
- 0688US10763214B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Sep 1, 2020·6 cites·19 claims
- 0786US10643960B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted May 5, 2020·5 cites·17 claims
- 0883US7253515B2Semiconductor package featuring metal lid memberNEC ELECTRONICS CORP·Filed 2006·Granted Aug 7, 2007·15 cites·19 claims
- 0981US9853002B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 26, 2017·3 cites·18 claims
- 1080US10541216B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jan 21, 2020·3 cites·19 claims
- 1179US9035450B2Semiconductor device and interconnect substrateRENESAS ELECTRONICS CORP·Filed 2014·Granted May 19, 2015·4 cites·20 claims
- 1278US10159144B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 18, 2018·4 cites·18 claims
- 1377US10147690B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 4, 2018·2 cites·11 claims
- 1475US10515890B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 24, 2019·2 cites·21 claims
- 1573US9312216B2Semiconductor device with semiconductor chip and wiring layersRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 12, 2016·2 cites·18 claims
- 1673US7986038B2Electronic device and lidRENESAS ELECTRONICS CORP·Filed 2009·Granted Jul 26, 2011·5 cites·20 claims
- 1772US8975528B2Electronic device, wiring substrate, and method for manufacturing electronic deviceKARIYAZAKI SHUUICHI·Filed 2012·Granted Mar 10, 2015·4 cites·20 claims
- 1868US10347552B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·13 claims
- 1967US11990397B2Semiconductor device having conductive patterns with mesh pattern and differential signal wiringsRENESAS ELECTRONICS CORP·Filed 2023·Granted May 21, 2024·0 cites·20 claims
- 2064US2025218918A1Electronic deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2163US2025029933A1Electronic deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2262US2025046741A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2359US11605581B2Semiconductor device having conductive patterns with mesh pattern and differential signal wiringsRENESAS ELECTRONICS CORP·Filed 2021·Granted Mar 14, 2023·0 cites·12 claims
- 2456US12199053B2Electronic device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 2555US9142519B2Semiconductor device with covering member that partially covers wiring substrateRENESAS ELECTRONICS CORP·Filed 2014·Granted Sep 22, 2015·0 cites·10 claims
- 2653US12237254B2Semiconductor device including wiring substrate having multiple signal wirings and multiple insulating layersRENESAS ELECTRONICS CORP·Filed 2022·Granted Feb 25, 2025·0 cites·10 claims
- 2752US12218044B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Feb 4, 2025·0 cites·13 claims
- 2852US11948916B2Semiconductor device having a plurality of terminals arranged thereonRENESAS ELECTRONICS CORP·Filed 2021·Granted Apr 2, 2024·0 cites·6 claims
- 2951US11658081B2Semiconductor apparatus and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2021·Granted May 23, 2023·0 cites·10 claims
- 3051US9087709B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 21, 2015·0 cites·20 claims
- 3150US11699645B2Semiconductor device having wiring substrate with lead-out wiringsRENESAS ELECTRONICS CORP·Filed 2021·Granted Jul 11, 2023·0 cites·12 claims
- 3250US8922001B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 30, 2014·0 cites·20 claims
- 3349US11049786B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Jun 29, 2021·0 cites·15 claims
- 3448US9620447B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Apr 11, 2017·0 cites·11 claims
- 3546US11158597B2Electronic device including through conductors in sealing bodyRENESAS ELECTRONICS CORP·Filed 2020·Granted Oct 26, 2021·0 cites·15 claims
- 3646US2015364392A1Semiconductor device with covering member that partially covers wiring substrateRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3745US2015123258A1Semiconductor device and interconnect substrateRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3839US2011235298A1Wiring substrate and method of manufacturing the wiring substrateRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 3937US11101206B2Semiconductor device and electronic deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Aug 24, 2021·0 cites·16 claims
- 4037US10643939B2High speed semiconductor device with noise reduction wiring patternRENESAS ELECTRONICS CORP·Filed 2018·Granted May 5, 2020·0 cites·18 claims
- 4133US9461016B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 4, 2016·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →