Inventor · disambiguated record
Shayan Kaviani
Also filed as: KAVIANI SHAYAN
0 granted patents·23 pending applications·0 citations·filing 2022–2024
Top patents by PatentIndex Score
23 records- 0161US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0258US2025210506A1Passivation boundary defects for reduced leakage current capacitor dielectric materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 0358US2025218962A1Technologies for a stack of components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0458US2025218956A1Methods and apparatus for mounting semiconductor devices in cavitiesINTEL CORP·Filed 2023·Application pending·0 cites
- 0558US2025218881A1Liquid-based method for embedding components in thick substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0657US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0757US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0856US2025218929A1Embedded deep trench capacitors in integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0956US2025006781A1Carbon nanofiber capacitor apparatus and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 1056US2025006671A1Semiconductor layer with dry deposition layerINTEL CORP·Filed 2023·Application pending·0 cites
- 1154US2024213132A1Thin film capacitors (tfcs) in etched back deep viaINTEL CORP·Filed 2022·Application pending·0 cites
- 1254US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 1353US2025106997A1Electroless seed layer deposition on glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1453US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 1552US2024222018A1Substrate package-integrated oxide capacitors and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 1651US2024113048A1Integrated horizontal varistor on glass core for voltage regulationINTEL CORP·Filed 2022·Application pending·0 cites
- 1751US2024213301A1Thin film capacitor (tfc) architectures for package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 1950US2024113046A1Embedded thin film varistor in through glass viasINTEL CORP·Filed 2022·Application pending·0 cites
- 2048US2024186136A1Polymeric films as an adhesive promotion/buffer layer at glass-dielectric or metal-dielectric interfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 2147US2024096561A1Thin film capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 2244US2024107784A1Methods and apparatus utilizing conjugated polymers in integrated circuit packages with glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 2344US2023298971A1Microelectronic structure including conductive polymer in trenches of a core substrate, and method of making sameINTEL CORP·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shayan Kaviani files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →