Inventor · disambiguated record
Shinya Kawai
Also filed as: KAWAI SHINYA
13 granted patents·3 pending applications·278 citations·filing 1999–2022
92Inventor score
Files withKYOCERA CORP10CANON MACHINERY INC1KAWAI SHINYA1KOBEICO METAL POWDER OF AMERIC1KOBELCO METAL POWDER OF AMERIC1
Top patents by PatentIndex Score
16 records- 0194US6413620B1Ceramic wiring substrate and method of producing the sameKYOCERA CORP·Filed 2000·Granted Jul 2, 2002·90 cites·19 claims
- 0281US6630417B2Porcelain composition, porcelain and method of producing the same, and wiring board and method of producing the sameKYOCERA CORP·Filed 2001·Granted Oct 7, 2003·24 cites·10 claims
- 0379US6391083B1Mixture for powder metallurgy product and method for producing the sameKOBEICO METAL POWDER OF AMERIC·Filed 2000·Granted May 21, 2002·19 cites·16 claims
- 0476US6264718B1Powder metallurgy product and method for manufacturing the sameKOBELCO METAL POWDER OF AMERIC·Filed 2000·Granted Jul 24, 2001·16 cites·23 claims
- 0574US6232251B1Dielectric ceramicsKYOCERA CORP·Filed 1999·Granted May 15, 2001·48 cites·11 claims
- 0670US6664567B2Photoelectric conversion device, glass composition for coating silicon, and insulating coating in contact with siliconKYOCERA CORP·Filed 2002·Granted Dec 16, 2003·17 cites·11 claims
- 0769US6953756B2Glass ceramic sintered body and wiring board using the sintered bodyKYOCERA CORP·Filed 2003·Granted Oct 11, 2005·11 cites·15 claims
- 0869US6579818B2Glass ceramic sintered productKYOCERA CORP·Filed 2001·Granted Jun 17, 2003·15 cites·17 claims
- 0964US7226654B2Laminated wiring board and its mounting structureKYOCERA CORP·Filed 2004·Granted Jun 5, 2007·13 cites·17 claims
- 1057US6201307B1Ceramics for wiring boards and method of producing the sameKYOCERA CORP·Filed 1999·Granted Mar 13, 2001·22 cites·8 claims
- 1156US12294313B2Drive system and control device for drive systemTOSHIBA MITSUBISHI ELECTRIC INDUSTRIAL SYSTEMS CORP·Filed 2021·Granted May 6, 2025·0 cites·13 claims
- 1252US2025149498A1Position alignment device, position alignment method, bonding device, bonding method, and method for manufacturing semiconductor deviceCANON MACHINERY INC·Filed 2022·Application pending·0 cites
- 1350US8281452B2Wiper deviceKAWAI SHINYA·Filed 2009·Granted Oct 9, 2012·3 cites·13 claims
- 1446US7605101B2Laminate, ceramic substrate and method for making the ceramic substrateKYOCERA CORP·Filed 2007·Granted Oct 20, 2009·0 cites·19 claims
- 1546US2006156436A1Transgenic plant having fructooligosaccharide accumulated therein and process for constructingMEIJI SEIKA KAISHA·Filed 2004·Application pending·0 cites
- 1643US2015366077A1Method for producing mounted structureKYOCERA CORP·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shinya Kawai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →