Inventor · disambiguated record
Shuichi Kawano
Also filed as: KAWANO SHUICHI
22 granted patents·7 pending applications·266 citations·filing 1994–2022
94Inventor score
Top patents by PatentIndex Score
29 records- 0197US7589394B2InterposerIBIDEN CO LTD·Filed 2008·Granted Sep 15, 2009·90 cites·22 claims
- 0287US7742277B2Dielectric film capacitor and method of manufacturing the sameIBIDEN COMPANY LTD·Filed 2006·Granted Jun 22, 2010·17 cites·18 claims
- 0383US5440491APseudo GPS signal transmitting system in a base stationTOSHIBA KK·Filed 1994·Granted Aug 8, 1995·99 cites·3 claims
- 0482US9086428B2Functional device, method of manufacturing the functional device, physical quantity sensor, and electronic apparatusYODA MITSUHIRO·Filed 2011·Granted Jul 21, 2015·6 cites·20 claims
- 0582US8149585B2Interposer and electronic device using the sameKAWANO SHUICHI·Filed 2007·Granted Apr 3, 2012·10 cites·20 claims
- 0680US8436252B2Printed wiring board and method for manufacturing the sameKAWANO SHUICHI·Filed 2010·Granted May 7, 2013·5 cites·29 claims
- 0772US9068835B2Functional element, sensor element, electronic apparatus, and method for producing a functional elementYODA MITSUHIRO·Filed 2012·Granted Jun 30, 2015·2 cites·18 claims
- 0872US8455766B2Substrate with low-elasticity layer and low-thermal-expansion layerTANAKA HIRONORI·Filed 2008·Granted Jun 4, 2013·6 cites·9 claims
- 0969US8188378B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted May 29, 2012·4 cites·17 claims
- 1069US7751205B2Package board integrated with power supplyIBIDEN CO LTD·Filed 2006·Granted Jul 6, 2010·4 cites·17 claims
- 1163US8004148B2Surface acoustic wave elementSEIKO EPSON CORP·Filed 2009·Granted Aug 23, 2011·5 cites·4 claims
- 1263US2015014903A1Die for extrusion molding, method of producing die for extrusion molding, and method of producing honeycomb structured bodyIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 1361US7911802B2Interposer, a method for manufacturing the same and an electronic circuit packageIBIDEN CO LTD·Filed 2007·Granted Mar 22, 2011·2 cites·13 claims
- 1459US2016229083A1Method of producing die for extrusion molding and method of producing honeycomb structured bodyIBIDEN CO LTD·Filed 2016·Application pending·0 cites
- 1558US9678100B2Functional device, method of manufacturing the functional device, physical quantity sensor, and electronic apparatusSEIKO EPSON CORP·Filed 2015·Granted Jun 13, 2017·0 cites·18 claims
- 1654US10641788B2Electronic device, electronic device apparatus, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2017·Granted May 5, 2020·0 cites·18 claims
- 1753US8173907B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted May 8, 2012·0 cites·41 claims
- 1850US10935567B2Physical quantity sensor, electronic device, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Mar 2, 2021·0 cites·18 claims
- 1950US8997344B2Method for manufacturing interposerSAKAMOTO HAJIME·Filed 2011·Granted Apr 7, 2015·0 cites·20 claims
- 2050US2022239280A1Acoustic wave filterMURATA MANUFACTURING CO·Filed 2022·Application pending·0 cites
- 2150US2015017343A1Die for extrusion molding, method of producing die for extrusion molding, extruder, and method of producing honeycomb structured bodyIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2250US2008017407A1Interposer and electronic device using the sameIBIDEN CO LTD·Filed 2006·Application pending·0 cites
- 2346US2015014902A1Die for extrusion molding, method of producing die for extrusion molding, and method of producing honeycomb structured bodyIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2445US2007182279A1Surface acoustic wave device and electronic apparatusSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 2544US8178790B2Interposer and method for manufacturing interposerFURUTANI TOSHIKI·Filed 2008·Granted May 15, 2012·0 cites·15 claims
- 2639US5760738AGPS overlay system for a geostationary satelliteTOSHIBA KK·Filed 1996·Granted Jun 2, 1998·16 cites·4 claims
- 2735US8674790B2Surface acoustic wave device, oscillator, module apparatusKAWANO SHUICHI·Filed 2010·Granted Mar 18, 2014·0 cites·17 claims
- 2835US8624690B2Surface acoustic wave device, oscillator, module apparatusKAWANO SHUICHI·Filed 2010·Granted Jan 7, 2014·0 cites·18 claims
- 2935US8247289B2Capacitor and manufacturing method thereofYAMANISHI YOSHIKI·Filed 2006·Granted Aug 21, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →