Inventor · disambiguated record
Shinichi Kazui
Also filed as: KAZUI SHINICHI
34 granted patents·2 pending applications·857 citations·filing 1985–2014
98Inventor score
Top patents by PatentIndex Score
36 records- 0197US5968382ALaser cleavage cutting method and systemHITACHI LTD·Filed 1996·Granted Oct 19, 1999·183 cites·21 claims
- 0292US9290831B2Soft-magnetic, amorphous alloy ribbon and its production method, and magnetic core constituted therebyYOSHIZAWA YOSHIHITO·Filed 2010·Granted Mar 22, 2016·7 cites·16 claims
- 0390US6137687APrinted circuit board, IC card, and manufacturing method thereofHITACHI LTD·Filed 2000·Granted Oct 24, 2000·66 cites·7 claims
- 0489US4766009ASelective working methodHITACHI LTD·Filed 1987·Granted Aug 23, 1988·43 cites·24 claims
- 0587US5150274AMulti-chip-moduleHITACHI LTD·Filed 1991·Granted Sep 22, 1992·102 cites·8 claims
- 0687US4659587AElectroless plating process and process for producing multilayer wiring boardHITACHI LTD·Filed 1985·Granted Apr 21, 1987·65 cites·15 claims
- 0786US9978497B2Wound magnetic core and method of producing the sameHITACHI METALS LTD·Filed 2014·Granted May 22, 2018·6 cites·5 claims
- 0878US5832595AMethod of modifying conductive lines of an electronic circuit board and its apparatusHITACHI LTD·Filed 1994·Granted Nov 10, 1998·58 cites·7 claims
- 0977US6498319B1Method and an apparatus for manufacturing multi-layer boards using laser lightHITACHI LTD·Filed 2000·Granted Dec 24, 2002·27 cites·16 claims
- 1075US5801350ASurface reformation method of high polymer materialHITACHI LTD·Filed 1996·Granted Sep 1, 1998·39 cites·19 claims
- 1174US6406357B1Grinding method, semiconductor device and method of manufacturing semiconductor deviceHITACHI LTD·Filed 2000·Granted Jun 18, 2002·19 cites·8 claims
- 1272US5499668AProcess for making electronic deviceHITACHI LTD·Filed 1994·Granted Mar 19, 1996·43 cites·10 claims
- 1368US6069701AMethod and apparatus for measuring the height of an objectHITACHI LTD·Filed 1997·Granted May 30, 2000·29 cites·16 claims
- 1466US6269998B1Process for manufacturing electronic circuitsHITACHI LTD·Filed 2000·Granted Aug 7, 2001·9 cites·8 claims
- 1565US4620663AParts-connecting apparatus using solderHITACHI LTD·Filed 1985·Granted Nov 4, 1986·20 cites·5 claims
- 1661US6340109B2Solder bump measuring method and apparatusHITACHI LTD·Filed 2001·Granted Jan 22, 2002·5 cites·4 claims
- 1761US5390446AGrinding method and grinding machineHITACHI LTD·Filed 1992·Granted Feb 21, 1995·19 cites·4 claims
- 1860US6161748AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 2000·Granted Dec 19, 2000·6 cites·5 claims
- 1959US7614541B2Method and apparatus for placing conductive ballsHITACHI METALS LTD·Filed 2008·Granted Nov 10, 2009·2 cites·28 claims
- 2059US5551148AMethod for forming conductive bumpsHITACHI LTD·Filed 1994·Granted Sep 3, 1996·27 cites·2 claims
- 2157US6677553B2Laser processing apparatusHITACHI LTD·Filed 2002·Granted Jan 13, 2004·9 cites·18 claims
- 2257US5940728AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 1996·Granted Aug 17, 1999·15 cites·21 claims
- 2355US5906309ASolder bump measuring method and apparatusHITACHI LTD·Filed 1996·Granted May 25, 1999·15 cites·10 claims
- 2450US2011177292A1Ceramic assembled board, method of manufacturing the same, ceramic substrate and ceramic circuit substrateHITACHI METALS LTD·Filed 2009·Application pending·0 cites
- 2549US2014106129A1Ceramic assembled board, method of manufacturing the same, ceramic substrate and ceramic circuit substrateHITACHI METALS LTD·Filed 2013·Application pending·0 cites
- 2646US7431792B2Method and apparatus for placing conductive ballsHITACHI METALS LTD·Filed 2004·Granted Oct 7, 2008·2 cites·15 claims
- 2746US6410881B2Process for manufacturing electronic circuitsHITACHI LTD·Filed 2001·Granted Jun 25, 2002·1 cites·12 claims
- 2844US6551449B2Thin electronic circuit component and method and apparatus for producing the sameHITACHI LTD·Filed 2001·Granted Apr 22, 2003·2 cites·5 claims
- 2942US6203655B1Thin electronic circuit component and method and apparatus for producing the sameHITACHI LTD·Filed 1998·Granted Mar 20, 2001·11 cites·10 claims
- 3039US6133135AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 1999·Granted Oct 17, 2000·5 cites·8 claims
- 3136US5023407APrinted circuit board with a uniform conductive layer formed by equalization of metals thereinHITACHI LTD·Filed 1989·Granted Jun 11, 1991·6 cites·16 claims
- 3235US6196441B1Solder bump measuring method and apparatusHITACHI LTD·Filed 1999·Granted Mar 6, 2001·3 cites·5 claims
- 3334US5498109ADrilling apparatus of hard brittle material and method thereofHITACHI LTD·Filed 1994·Granted Mar 12, 1996·5 cites·19 claims
- 3433US5520733ADeposition apparatus and profile-following device suitable for apparatuses such as those for depositionHITACHI LTD·Filed 1994·Granted May 28, 1996·5 cites·18 claims
- 3532US6423405B1Surface reformation method of high polymer materialHITACHI LTD·Filed 1999·Granted Jul 23, 2002·2 cites·8 claims
- 3630US6017424ALaser assisted surface reformation method of high polymer materialHITACHI LTD·Filed 1998·Granted Jan 25, 2000·1 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Shinichi Kazui files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →