Inventor · disambiguated record
Shigenori Kido
Also filed as: KIDO SHIGENORI
7 granted patents·2 pending applications·38 citations·filing 2000–2019
81Inventor score
Top patents by PatentIndex Score
9 records- 0169US6787878B1Semiconductor device having a potential fuse, and method of manufacturing the sameRENESAS TECH CORP·Filed 2000·Granted Sep 7, 2004·17 cites·1 claims
- 0255US6744143B1Semiconductor device having test markRENESAS TECH CORP·Filed 2000·Granted Jun 1, 2004·5 cites·8 claims
- 0354US6337268B1Method of manufacturing contact structureMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 8, 2002·7 cites·9 claims
- 0454US6313005B1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 6, 2001·7 cites·11 claims
- 0544US6400022B1Semiconductor device and fabrication process therefor and capacitor structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 4, 2002·2 cites·10 claims
- 0642US10892329B2Method for manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 12, 2021·0 cites·8 claims
- 0735US6775920B2Method of fabricating semiconductor device comprising superposition inspection stepRENESAS TECH CORP·Filed 2003·Granted Aug 17, 2004·0 cites·5 claims
- 0833US2003020066A1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 0932US2003022489A1Method of fabricating high melting point metal wiring layer, method of fabricating semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →