Inventor · disambiguated record
Shin Kim
Also filed as: KIM SHIN · KIM SHIN-HYUNG
0 granted patents·5 pending applications·0 citations·filing 2006–2011
Top patents by PatentIndex Score
5 records- 0149US2008105869A1Printed circuit board for mounting semiconductor device package, and method of testing and fabricating semiconductor device package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0246US2007158843A1Semiconductor package having improved solder joint reliability and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0344US2010127373A1Package structureKIM SHIN·Filed 2009·Application pending·0 cites
- 0438US2007029674A1Board-on-chip package and stack package using the sameSHIN DONG-KIL·Filed 2006·Application pending·0 cites
- 0531US2012227555A1Insert member, apparatus for blanking printed circuit film having the same and method of blanking printed circuit film using the apparatusKIM MINILL·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →