Inventor · disambiguated record
Shinya Kiyono
Also filed as: KIYONO SHINYA
5 granted patents·1 citations·filing 2013–2021
63Inventor score
Files withMURATA MANUFACTURING CO5
Top patents by PatentIndex Score
5 records- 0168US11552020B2Semiconductor composite device and package board used thereinMURATA MANUFACTURING CO·Filed 2021·Granted Jan 10, 2023·0 cites·17 claims
- 0260US11121123B2Semiconductor composite device and package board used thereinMURATA MANUFACTURING CO·Filed 2020·Granted Sep 14, 2021·0 cites·19 claims
- 0357US9860989B2Electronic component module and method for manufacturing electronic component moduleMURATA MANUFACTURING CO·Filed 2016·Granted Jan 2, 2018·1 cites·9 claims
- 0446US10177108B2Method of manufacturing electronic component module and electronic component moduleMURATA MANUFACTURING CO·Filed 2016·Granted Jan 8, 2019·0 cites·9 claims
- 0546US9532495B2Method of manufacturing electronic component module and electronic component moduleMURATA MANUFACTURING CO·Filed 2013·Granted Dec 27, 2016·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →