Inventor · disambiguated record
Shogo Kiyota
Also filed as: KIYOTA SHOGO
9 granted patents·2 pending applications·66 citations·filing 1997–2004
88Inventor score
Top patents by PatentIndex Score
11 records- 0169US6368905B1Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceHITACHI LTD·Filed 2000·Granted Apr 9, 2002·9 cites·17 claims
- 0266US6444514B1Semiconductor integrated circuit device and manufacturing method thereofHITACHI LTD·Filed 2000·Granted Sep 3, 2002·10 cites·18 claims
- 0365US6685805B2Method of manufacturing substrate having transparent conductive film, substrate having transparent conductive film manufactured using the method, and touch panel using the substrateNIPPON SHEET GLASS CO LTD·Filed 2001·Granted Feb 3, 2004·8 cites·10 claims
- 0463US6806130B2Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Oct 19, 2004·6 cites·11 claims
- 0562US6630375B2Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceHITACHI LTD·Filed 2001·Granted Oct 7, 2003·6 cites·4 claims
- 0661US6043114AProcess for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceHITACHI LTD·Filed 1997·Granted Mar 28, 2000·19 cites·42 claims
- 0753US6815761B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Nov 9, 2004·4 cites·22 claims
- 0847US6583467B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Jun 24, 2003·2 cites·12 claims
- 0945US7005673B2ITO film-formed substrate, and manufacturing method thereofNIPPON SHEET GLASS CO LTD·Filed 2004·Granted Feb 28, 2006·2 cites·18 claims
- 1042US2004219727A1Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceKAWAGOE HIROTO·Filed 2004·Application pending·0 cites
- 1138US2004229465A1Method of manufacturing transparent substrate, transparent substrate, and organic electroluminescent device having the transparent substrateNIPPON SHEET GLASS CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →