Inventor · disambiguated record
Shintaro Komitsu
Also filed as: KOMITSU SHINTARO
13 granted patents·4 pending applications·310 citations·filing 1997–2008
92Inventor score
Top patents by PatentIndex Score
17 records- 0198US6642309B2Curable resin compositionKANEKA CORP·Filed 2002·Granted Nov 4, 2003·125 cites·21 claims
- 0296US6706813B2Curable composition and method of use thereofKANEKA CORP·Filed 2001·Granted Mar 16, 2004·85 cites·12 claims
- 0385US7144953B2Curable resin compositionKANEKA CORP·Filed 2002·Granted Dec 5, 2006·24 cites·4 claims
- 0474US7919182B2Pressure-sensitive adhesive sheet for application to skinNITTO DENKO CORP·Filed 2004·Granted Apr 5, 2011·20 cites·11 claims
- 0573US8008386B2Curable compositionKANEKA CORP·Filed 2007·Granted Aug 30, 2011·2 cites·15 claims
- 0672US8415444B2Curable compositionYANO AYAKO·Filed 2007·Granted Apr 9, 2013·2 cites·12 claims
- 0770US6031012ACurable composition, foam produced therefrom, and process for producing the foamKANEKA CORP·Filed 1997·Granted Feb 29, 2000·30 cites·9 claims
- 0869US8022149B2Organic polymer containing reactive silicon groupKANEKA CORP·Filed 2004·Granted Sep 20, 2011·8 cites·2 claims
- 0962US2008176007A1Pressure-sensitive adhesive compositionUEDA KAZUHIKO·Filed 2008·Application pending·0 cites
- 1059US7385006B2Reactive modifierKANEKA CORP·Filed 2004·Granted Jun 10, 2008·4 cites·3 claims
- 1151US7368518B2Pressure-sensitive adhesive compositionKANEKA CORP·Filed 2004·Granted May 6, 2008·0 cites·18 claims
- 1246US7718749B2Curable compositionKANEKA CORP·Filed 2004·Granted May 18, 2010·0 cites·9 claims
- 1346US7473441B2Curable composition and sealing method for ceramic siding boardsKANEKA CORP·Filed 2003·Granted Jan 6, 2009·10 cites·27 claims
- 1446US2007167583A1Curable compositionYANO AYAKO·Filed 2004·Application pending·0 cites
- 1543US7838586B2Resin composition and process for producing the sameKANEKA CORP·Filed 2004·Granted Nov 23, 2010·0 cites·7 claims
- 1639US2005267251A1Sealing material used for transparent material having photocatalyst layerKANEKA CORP·Filed 2003·Application pending·0 cites
- 1733US2006241249A1Curable resin composition and process for production thereofKASAI MITSUHIRO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →