Inventor · disambiguated record
Shrenik Kothari
Also filed as: KOTHARI SHRENIK
7 granted patents·6 pending applications·22 citations·filing 2015–2025
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0191US9515003B1Embedded air core inductors for integrated circuit package substrates with thermal conductorINTEL CORP·Filed 2015·Granted Dec 6, 2016·18 cites·20 claims
- 0286US11756860B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2019·Granted Sep 12, 2023·3 cites·25 claims
- 0384US12341080B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0484US2025293117A1Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2025·Application pending·0 cites
- 0579US11978689B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0661US2021375719A1Stacked die architectures with improved thermal managementINTEL CORP·Filed 2021·Application pending·0 cites
- 0760US11495518B2Multi-surface heat sink suitable for multi-chip packagesINTEL CORP·Filed 2019·Granted Nov 8, 2022·1 cites·16 claims
- 0851US11398414B2Sloped metal features for cooling hotspots in stacked-die packagesINTEL CORP·Filed 2018·Granted Jul 26, 2022·0 cites·11 claims
- 0946US2019214328A1Stacked die architectures with improved thermal managementEID FERAS·Filed 2018·Application pending·0 cites
- 1045US11551997B2Thermal management solutions using self-healing polymeric thermal interface materialsINTEL CORP·Filed 2019·Granted Jan 10, 2023·0 cites·25 claims
- 1142US2021257272A1Customized integrated heat spreader design with targeted doping for multi-chip packagesINTEL CORP·Filed 2020·Application pending·0 cites
- 1234US2020194332A1Multi-piece heat spreader for multi-chip packageINTEL CORP·Filed 2017·Application pending·0 cites
- 1331US2019027379A1Sintered heat spreaders with insertsINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →