Inventor · disambiguated record
Shih-Chang Ku
Also filed as: KU SHIH-CHANG
18 granted patents·22 pending applications·108 citations·filing 2003–2025
92Inventor score
Top patents by PatentIndex Score
40 records- 0198US11594469B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·6 cites·20 claims
- 0291US10515867B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·6 cites·17 claims
- 0390US12300575B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·1 cites·20 claims
- 0490US10978373B2Semiconductor device methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·5 cites·19 claims
- 0589US12272616B2Heat-dissipating structures for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·1 cites·20 claims
- 0684US7477515B2Electronic apparatus and thermal dissipating module thereofVIA TECH INC·Filed 2006·Granted Jan 13, 2009·18 cites·19 claims
- 0784US6914782B2Multi-opening heat-dissipation device for high-power electronic componentsVIA TECH INC·Filed 2003·Granted Jul 5, 2005·42 cites·13 claims
- 0883US11676943B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·1 cites·20 claims
- 0982US11088048B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 1081US2025323121A1Semiconductor package and manufacturing method thereoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1180US7355849B2Non-metal mesh cover for metal chassisVIA TECHNOLOGIES INC OF R O C·Filed 2006·Granted Apr 8, 2008·5 cites·20 claims
- 1279US12412805B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·12 claims
- 1378US11282766B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·1 cites·20 claims
- 1477US2025331424A1Semiconductor packages with thermal structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1575US2024371828A1Semiconductor stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1675US2024379601A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1773US12125824B2Semiconductor stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 1873US2025212688A1Semiconductor packages with thermal structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1972US11587845B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 2072US2023144244A1Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2171US2025329608A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2270US7196904B2IC package with an implanted heat-dissipation finVIA TECH INC·Filed 2003·Granted Mar 27, 2007·17 cites·3 claims
- 2369US12125812B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 2469US2025201659A1Heat-Dissipating Structures for Semiconductor Devices and Methods of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2567US11996342B2Semiconductor package comprising heat dissipation platesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 2662US2025379168A1Semiconductor Packages and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2761US2025201650A1Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2858US2025052963A1Optical device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2958US2025391726A1Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3058US2025357266A1Cooling system with integrated micro coolerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3157US2024363547A1Chip package structure with anti-warpage structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3256US2024112983A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3354US2024030099A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3452US2023187406A1Packages With Deep Bond Pads and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3547US7248477B2Fan-shaped heat-dissipating deviceVIA TECH INC·Filed 2004·Granted Jul 24, 2007·3 cites·12 claims
- 3645US2006067051A1Lateral airflow fan-sink for electronic devicesVIA TECH INC·Filed 2005·Application pending·0 cites
- 3739US2004212962A1Lateral airflow fan-sink for electronic devicesVIA TECH INC·Filed 2003·Application pending·0 cites
- 3839US2006104034A1Heat-dissipating deviceVIA TECH INC·Filed 2005·Application pending·0 cites
- 3939US2005286229A1Modular heat-dissipation assembly structure for a PCBVIA TECH INC·Filed 2005·Application pending·0 cites
- 4036US2004099945A1IC package for a multi-chip moduleVIA TECH INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →