Inventor · disambiguated record
Sho Kumada
Also filed as: KUMADA SHO
3 granted patents·1 citations·filing 2016–2020
50Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0163US10573617B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 25, 2020·1 cites·14 claims
- 0261US11094664B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 17, 2021·0 cites·12 claims
- 0339US10468368B2Power semiconductor device having void filled with resinMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Nov 5, 2019·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →