Inventor · disambiguated record
Sheng-Liang Kuo
Also filed as: KUO SHENG-LIANG
9 granted patents·2 pending applications·24 citations·filing 2017–2025
83Inventor score
Top patents by PatentIndex Score
11 records- 0196US10942067B2Method and apparatus for surface and ambient temperature estimation for portable devicesMEDIATEK INC·Filed 2020·Granted Mar 9, 2021·6 cites·20 claims
- 0291US10573579B2Semiconductor package with improved heat dissipationMEDIATEK INC·Filed 2018·Granted Feb 25, 2020·10 cites·17 claims
- 0390US12087664B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2023·Granted Sep 10, 2024·1 cites·7 claims
- 0488US11640930B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2020·Granted May 2, 2023·2 cites·14 claims
- 0585US11302592B2Semiconductor package having a stiffener ringMEDIATEK INC·Filed 2018·Granted Apr 12, 2022·4 cites·16 claims
- 0680US2025316559A1Thermal module for a semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0776US2024387321A1Thermal module for a semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0873US12362258B2Thermal module for a semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0971US10739206B2Method and apparatus for surface and ambient temperature estimation for portable devicesMEDIATEK INC·Filed 2017·Granted Aug 11, 2020·1 cites·20 claims
- 1068US11728232B2Semiconductor package having a stiffener ringMEDIA TEK INC·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 1160US12300573B2Semiconductor device and manufacturing method thereofMEDIATEK INC·Filed 2022·Granted May 13, 2025·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →