Inventor · disambiguated record
Shigeo Kuroda
Also filed as: KURODA SHIGEO
15 granted patents·2 pending applications·579 citations·filing 1983–2023
94Inventor score
Top patents by PatentIndex Score
17 records- 0196US5067007ASemiconductor device having leads for mounting to a surface of a printed circuit boardHITACHI LTD·Filed 1991·Granted Nov 19, 1991·360 cites·11 claims
- 0289US12025926B2Electrophotographic member and heat fixing deviceCANON KK·Filed 2023·Granted Jul 2, 2024·1 cites·13 claims
- 0387US11556082B2Intermediary transfer belt, manufacturing method of the intermediary transfer belt, and image forming apparatusCANON KK·Filed 2019·Granted Jan 17, 2023·3 cites·7 claims
- 0486US11573515B2Fixing member and heat fixing apparatusCANON KK·Filed 2022·Granted Feb 7, 2023·1 cites·8 claims
- 0578US5223454AMethod of manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1991·Granted Jun 29, 1993·63 cites·11 claims
- 0670US2023195015A1Fixing member for electrophotography, fixing device, electrophotographic image formation device, and addition curing liquid silicone rubber mixtureCANON KK·Filed 2023·Application pending·0 cites
- 0764US5011788AProcess of manufacturing semiconductor integrated circuit device and product formed therebyHITACHI LTD·Filed 1988·Granted Apr 30, 1991·22 cites·21 claims
- 0858US5309011AWafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed thereinHITACHI LTD·Filed 1992·Granted May 3, 1994·24 cites·25 claims
- 0958US4819054ASemiconductor IC with dual groove isolationHITACHI LTD·Filed 1987·Granted Apr 4, 1989·18 cites·30 claims
- 1058US4739125AElectric component part having lead terminalsHITACHI LTD·Filed 1986·Granted Apr 19, 1988·27 cites·5 claims
- 1151US5141888AProcess of manufacturing semiconductor integrated circuit device having trench and field isolation regionsHITACHI LTD·Filed 1991·Granted Aug 25, 1992·15 cites·37 claims
- 1250US11841630B2Fixing member and heat fixing deviceCANON KK·Filed 2022·Granted Dec 12, 2023·0 cites·13 claims
- 1350US5191224AWafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed thereinHITACHI LTD·Filed 1990·Granted Mar 2, 1993·17 cites·32 claims
- 1444US5049972AMethod of manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1990·Granted Sep 17, 1991·14 cites·16 claims
- 1543US4965653ASemiconductor device and method of mounting the semiconductor deviceHITACHI LTD·Filed 1990·Granted Oct 23, 1990·14 cites·21 claims
- 1643US2009058916A1Image forming method and image forming apparatusCANON FINETECH INC·Filed 2008·Application pending·0 cites
- 1723US4469535AMethod of fabricating semiconductor integrated circuit devicesHITACHI LTD·Filed 1983·Granted Sep 4, 1984·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →