Inventor · disambiguated record
Shigeji Kuroda
Also filed as: KURODA SHIGEJI
5 granted patents·191 citations·filing 1989–1998
83Inventor score
Files withNITTO DENKO CORP5
Top patents by PatentIndex Score
5 records- 0190US5891298AMethod and apparatus for peeling protective adhesive tape from semiconductor waferNITTO DENKO CORP·Filed 1996·Granted Apr 6, 1999·125 cites·15 claims
- 0256US6235144B1Resist removing apparatus and methodNITTO DENKO CORP·Filed 1998·Granted May 22, 2001·21 cites·13 claims
- 0350US5246524ASemiconductor wafer processing systemNITTO DENKO CORP·Filed 1989·Granted Sep 21, 1993·21 cites·6 claims
- 0445US6249943B1Automatic semiconductor wafer applying apparatusNITTO DENKO CORP·Filed 1998·Granted Jun 26, 2001·16 cites·17 claims
- 0542US6099675AResist removing methodNITTO DENKO CORP·Filed 1998·Granted Aug 8, 2000·8 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →