Inventor · disambiguated record
Shunji Kuwahara
Also filed as: KUWAHARA SHUNJI
7 granted patents·37 citations·filing 2008–2021
81Inventor score
Top patents by PatentIndex Score
7 records- 0193US11705432B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·2 cites·18 claims
- 0287US7902858B2Calibration circuit, semiconductor device including the same, and memory moduleELPIDA MEMORY INC·Filed 2008·Granted Mar 8, 2011·22 cites·17 claims
- 0378US8278973B2Impedance control circuit and semiconductor device including the sameKUWAHARA SHUNJI·Filed 2010·Granted Oct 2, 2012·6 cites·18 claims
- 0473US11081468B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatusesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 3, 2021·1 cites·32 claims
- 0562US8461867B2Semiconductor device having plural unit buffers constituting output bufferKUWAHARA SHUNJI·Filed 2010·Granted Jun 11, 2013·3 cites·17 claims
- 0650US7872493B2Calibration circuitELPIDA MEMORY INC·Filed 2009·Granted Jan 18, 2011·2 cites·14 claims
- 0749US9041436B2Semiconductor device having pull-up circuit and pull-down circuitKUWAHARA SHUNJI·Filed 2011·Granted May 26, 2015·1 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →