Inventor · disambiguated record
Shuqi Lai
Also filed as: LAI SHUQI
1 granted patent·6 pending applications·0 citations·filing 2017–2024
8Inventor score
Top patents by PatentIndex Score
7 records- 0156US2025201732A1Microelectronic assemblies with crack-healing materials for glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2025349729A1Microelectronic assemblies with double liners in through-glass viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0353US2025300062A1Integrated circuit package comprising hollow filler-based build-up materialINTEL CORP·Filed 2024·Application pending·0 cites
- 0453US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0553US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 0650US2025006623A1Forming porous dielectric structures with spatially-controlled porosityINTEL CORP·Filed 2023·Application pending·0 cites
- 0741US10377879B2Chemical amplification in self-strengthening materialsUNIV ILLINOIS·Filed 2017·Granted Aug 13, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →