Inventor · disambiguated record
Shinn-Juh Lai
Also filed as: LAI SHINN-JUH
18 granted patents·1 pending application·139 citations·filing 2006–2011
93Inventor score
Top patents by PatentIndex Score
19 records- 0192US8304666B2Structure of multiple coaxial leads within single via in substrate and manufacturing method thereofKO CHENG-TA·Filed 2009·Granted Nov 6, 2012·41 cites·21 claims
- 0291US8035951B2Capacitor devicesIND TECH RES INST·Filed 2010·Granted Oct 11, 2011·13 cites·2 claims
- 0389US8094429B2Multilayer capacitors and methods for making the sameHSU CHIEN-MIN·Filed 2009·Granted Jan 10, 2012·18 cites·27 claims
- 0484US7894172B2ESD protection structureIND TECH RES INST·Filed 2008·Granted Feb 22, 2011·14 cites·28 claims
- 0584US7742276B2Wiring structure of laminated capacitorsIND TECH RES INST·Filed 2007·Granted Jun 22, 2010·12 cites·19 claims
- 0683US7804678B2Capacitor devicesIND TECH RES INST·Filed 2007·Granted Sep 28, 2010·9 cites·14 claims
- 0780US7764512B2Mirror image shielding structureIND TECH RES INST·Filed 2006·Granted Jul 27, 2010·7 cites·8 claims
- 0876US8488299B2Capacitor structureWU SHIH-HSIEN·Filed 2010·Granted Jul 16, 2013·4 cites·13 claims
- 0975US7649723B2ESD protection substrate and integrated circuit utilizing the sameIND TECH RES INST·Filed 2008·Granted Jan 19, 2010·7 cites·18 claims
- 1071US8179695B2Mirror image shielding structureJOW UEI-MING·Filed 2010·Granted May 15, 2012·2 cites·16 claims
- 1168US8125761B2Capacitor devices with co-coupling electrode planesHSU CHIEN-MIN·Filed 2009·Granted Feb 28, 2012·4 cites·23 claims
- 1267US8071890B2Electrically conductive structure of circuit board and circuit board using the sameHSU CHIEN-MIN·Filed 2008·Granted Dec 6, 2011·3 cites·22 claims
- 1355US8198538B2Capacitor devices having multi-sectional conductorsHSU CHIEN-MIN·Filed 2009·Granted Jun 12, 2012·2 cites·14 claims
- 1454US8227894B2Stepwise capacitor structure and substrate employing the sameLEE MIN-LIN·Filed 2009·Granted Jul 24, 2012·2 cites·41 claims
- 1551US8049512B2Circuit board with embedded components and manufacturing and measuring method thereofIND TECH RES INST·Filed 2007·Granted Nov 1, 2011·1 cites·6 claims
- 1645US2009128993A1Multi-tier capacitor structure, fabrication method thereof and semiconductor substrate employing the sameIND TECHNOLOGY REASERCH INST·Filed 2008·Application pending·0 cites
- 1742US7308377B2Test method of embedded capacitor and test system thereofIND TECH RES INST·Filed 2006·Granted Dec 11, 2007·0 cites·42 claims
- 1834US8237520B2Capacitor devices with a filter structureCHANG HUEY-RU·Filed 2009·Granted Aug 7, 2012·0 cites·24 claims
- 1932US8525328B2Power device package structurePERNG JIIN-SHING·Filed 2011·Granted Sep 3, 2013·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →