Inventor · disambiguated record
Shinn-Juh Lay
Also filed as: LAY SHINN-JUH
10 granted patents·2 pending applications·59 citations·filing 2002–2008
88Inventor score
Top patents by PatentIndex Score
12 records- 0184US7345366B2Apparatus and method for testing component built in circuit boardIND TECH RES INST·Filed 2005·Granted Mar 18, 2008·10 cites·22 claims
- 0283US7714590B2Method for testing component built in circuit boardIND TECH RES INST·Filed 2007·Granted May 11, 2010·9 cites·11 claims
- 0378US7349196B2Composite distributed dielectric structureIND TECH RES INST·Filed 2005·Granted Mar 25, 2008·8 cites·23 claims
- 0474US7515435B2Multi-functional composite substrate structureIND TECH RES INST·Filed 2006·Granted Apr 7, 2009·5 cites·21 claims
- 0573US8174840B2Multi-functional composite substrate structureJOW UEI-MING·Filed 2008·Granted May 8, 2012·5 cites·41 claims
- 0665US6683781B2Packaging structure with low switching noisesIND TECH RES INST·Filed 2002·Granted Jan 27, 2004·13 cites·20 claims
- 0764US8035036B2Complementary mirror image embedded planar resistor architectureIND TECH RES INST·Filed 2007·Granted Oct 11, 2011·2 cites·12 claims
- 0864US7893359B2Embedded capacitor core having a multiple-layer structureIND TECH RES INST·Filed 2006·Granted Feb 22, 2011·2 cites·15 claims
- 0963US7875808B2Embedded capacitor device having a common coupling areaIND TECH RES INST·Filed 2006·Granted Jan 25, 2011·2 cites·19 claims
- 1043US7064427B2Buried array capacitor and microelectronic structure incorporating the sameIND TECH RES INST·Filed 2004·Granted Jun 20, 2006·3 cites·23 claims
- 1136US2004211954A1Compositive laminate substrate with inorganic substrate and organic substrateFiled 2003·Application pending·0 cites
- 1232US2007164395A1Chip package with built-in capacitor structurePERNG JIIN-SHING·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →