Inventor · disambiguated record
Shih-Chang Lee
Also filed as: LEE SHIH-CHANG
81 granted patents·33 pending applications·933 citations·filing 1999–2025
99Inventor score
Files withEPISTAR CORP58ADVANCED SEMICONDUCTOR ENG27LEE SHIH-CHANG7LEE CHUNG-SHU4NAT APPLIED RES LABORATORIES3
Top patents by PatentIndex Score
114 records- 0196US9331239B1Light-emitting deviceEPISTAR CORP·Filed 2015·Granted May 3, 2016·16 cites·20 claims
- 0296US7061079B2Chip package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 13, 2006·144 cites·19 claims
- 0396US7015571B2Multi-chips module assembly packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 21, 2006·105 cites·21 claims
- 0495US7002805B2Thermal enhance MCM package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 21, 2006·112 cites·12 claims
- 0593US6262490B1Substrate strip for use in packaging semiconductor chipsADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jul 17, 2001·154 cites·7 claims
- 0691US9847450B2Light-emitting device and manufacturing method thereofEPISTAR CORP·Filed 2014·Granted Dec 19, 2017·6 cites·16 claims
- 0791US9444019B1Method for reusing a substrate for making light-emitting deviceEPISTAR CORP·Filed 2015·Granted Sep 13, 2016·4 cites·20 claims
- 0890US10756134B2Light-emitting deviceEPISTAR CORP·Filed 2018·Granted Aug 25, 2020·3 cites·20 claims
- 0990US10156335B1Light-emitting deviceEPISTAR CORP·Filed 2017·Granted Dec 18, 2018·7 cites·20 claims
- 1089US12230736B2Semiconductor light-emitting device and semiconductor light-emitting componentEPISTAR CORP·Filed 2021·Granted Feb 18, 2025·2 cites·20 claims
- 1189US11158757B2Optical sensing device and optical sensing system thereof comprising a light receiving device capable of receiving a first received wavelength having a largest external quantum efficiencyEPISTAR CORP·Filed 2019·Granted Oct 26, 2021·5 cites·20 claims
- 1289US9153944B2Light-emitting arrayEPISTAR CORP·Filed 2014·Granted Oct 6, 2015·10 cites·20 claims
- 1389US8755665B2Electromagnetic wave gathering device and solar cell module having the sameHONG KAI-YI·Filed 2011·Granted Jun 17, 2014·12 cites·19 claims
- 1487US6242815B1Flexible substrate based ball grid array (BGA) packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jun 5, 2001·79 cites·13 claims
- 1586US10032954B2Light-emitting device and manufacturing method thereofEPISTAR CORP·Filed 2017·Granted Jul 24, 2018·4 cites·20 claims
- 1685US8179222B2Transformer with conductive plate winding structureLEE CHUNG-SHU·Filed 2009·Granted May 15, 2012·17 cites·14 claims
- 1783US10134735B2Heterogeneously integrated semiconductor device and manufacturing method thereofNAT APPLIED RES LABORATORIES·Filed 2017·Granted Nov 20, 2018·3 cites·18 claims
- 1882US9048376B2Solar cell devices and apparatus comprising the sameLIN YI-CHIEH·Filed 2010·Granted Jun 2, 2015·3 cites·17 claims
- 1982US6815833B2Flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 9, 2004·33 cites·50 claims
- 2080US7019407B2Flip chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 28, 2006·31 cites·8 claims
- 2179USD1062026SLight-emitting deviceEPISTAR CORP·Filed 2022·Granted Feb 11, 2025·5 cites·1 claims
- 2279US11227975B2Semiconductor structure having a bridge layerEPISTAR CORP·Filed 2019·Granted Jan 18, 2022·1 cites·20 claims
- 2378US12514027B2Semiconductor photo-detecting deviceEPISTAR CORP·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 2478US9640728B2Optoelectronic device and the manufacturing method thereofEPISTAR CORP·Filed 2016·Granted May 2, 2017·2 cites·17 claims
- 2576US6624004B2Flip chip interconnected structure and a fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Sep 23, 2003·17 cites·14 claims
- 2675US7187070B2Stacked package moduleADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 6, 2007·22 cites·16 claims
- 2775US2025015246A1Semiconductor device and semiconductor component including the sameEPISTAR CORP·Filed 2024·Application pending·0 cites
- 2874US2024136463A1Optical sensing device and optical sensing system thereofEPISTAR CORP·Filed 2023·Application pending·0 cites
- 2973US10312407B2Light-emitting device and manufacturing method thereofEPISTAR CORP·Filed 2018·Granted Jun 4, 2019·1 cites·20 claims
- 3072US12051767B2Semiconductor device and semiconductor component including the same preliminary classEPISTAR CORP·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 3172US11005007B2Light-emitting device and manufacturing method thereofEPISTAR CORP·Filed 2019·Granted May 11, 2021·0 cites·18 claims
- 3272US8879268B2Cooling system for an electronic rackLEE SHIH-CHANG·Filed 2012·Granted Nov 4, 2014·3 cites·11 claims
- 3370US11894481B2Optical sensing device and optical sensing system thereof comprising light emitting device and light receiving device completely sandwiched by the topmost surface and bottommost surface of a carrier body with different vertically separated distancesEPISTAR CORP·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 3470US6524886B2Method of making leadless semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Feb 25, 2003·17 cites·12 claims
- 3570US6257857B1Molding apparatus for flexible substrate based packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 10, 2001·15 cites·2 claims
- 3669US10461223B2Semiconductor deviceEPISTAR CORP·Filed 2018·Granted Oct 29, 2019·1 cites·14 claims
- 3769US2025366261A1Semiconductor deviceEPISTAR CORP·Filed 2025·Application pending·0 cites
- 3868US10741721B2Light-emitting device and manufacturing method thereofEPISTAR CORP·Filed 2019·Granted Aug 11, 2020·0 cites·11 claims
- 3967US11515307B2Heterogeneously integrated semiconductor device and manufacturing method thereofNAT APPLIED RES LABORATORIES·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 4067US2022173292A1Semiconductor DeviceEPISTAR CORP·Filed 2021·Application pending·0 cites
- 4166USD972769SLight-emitting deviceEPISTAR CORP·Filed 2021·Granted Dec 13, 2022·3 cites·1 claims
- 4266US9609786B2Cooling system for an electronic rackACADEMIA SINICA·Filed 2014·Granted Mar 28, 2017·1 cites·12 claims
- 4366US7193282B2Contact sensor packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 20, 2007·3 cites·9 claims
- 4466US6916732B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 12, 2005·11 cites·21 claims
- 4566US6380002B2Method for fabricating a flexible substrate based ball grid array (BGA) packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Apr 30, 2002·11 cites·6 claims
- 4666US2025112443A1Semiconductor deviceEPISTAR CORP·Filed 2024·Application pending·0 cites
- 4766US2025006864A1Semiconductor deviceEPISTAR CORP·Filed 2024·Application pending·0 cites
- 4865US11935981B2Semiconductor photo-detecting deviceEPISTAR CORP·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 4965US11335826B2Semiconductor photo-detecting deviceEPISTAR CORP·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 5065US11145791B2Light-emitting deviceEPISTAR CORP·Filed 2019·Granted Oct 12, 2021·0 cites·20 claims
Showing the top 50 of 114 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →