Inventor · disambiguated record
Shlege Lee
Also filed as: LEE SHLEGE
1 granted patent·6 pending applications·0 citations·filing 2022–2025
8Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0153US2025038095A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0250US2025364516A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0347US2024321775A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0447US2024429146A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0545US12046546B2Package substrate and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 0637US2025349661A1Semiconductor package including a substrate having a trenchSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0731US2025357244A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →