Inventor · disambiguated record
Shle-Ge Lee
Also filed as: LEE SHLE GE
9 granted patents·6 pending applications·9 citations·filing 2007–2024
77Inventor score
Top patents by PatentIndex Score
15 records- 0181US8120176B2Semiconductor device having a conductive bumpSHIN DONG-KIL·Filed 2010·Granted Feb 21, 2012·8 cites·19 claims
- 0278US11527470B2Film package and method of fabricating package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 13, 2022·1 cites·19 claims
- 0356US2025022772A1Semiconductor package comprising stiffener and screwSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0454US2024234274A1Semiconductor package including an edge region having a plurality of solder balls thereinSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0553US11140772B2Printed circuit board including warpage offset regions and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·19 claims
- 0651US10506706B2Printed circuit board including warpage offset regions and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 0748US2024203958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0847US11024568B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·19 claims
- 0946US11776866B2Semiconductor module heatspreading lid having integrated separators for multiple chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·16 claims
- 1043US2020126899A1Printed circuit board and a semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1142US2008122056A1Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1240US10672694B2Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 2, 2020·0 cites·16 claims
- 1334US2019082084A1Image Sensor Modules Having Support StructuresSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1433US8427841B2Electronic deviceSHIN DONG-KIL·Filed 2010·Granted Apr 23, 2013·0 cites·6 claims
- 1530US9728497B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →