Inventor · disambiguated record
Shu-Ming Li
Also filed as: LI SHU XIA · LI SHU-MING
14 granted patents·9 pending applications·2 citations·filing 2001–2024
84Inventor score
Files withWINBOND ELECTRONICS CORP21
Top patents by PatentIndex Score
23 records- 0194US11917837B2Method of forming the semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Feb 27, 2024·2 cites·10 claims
- 0271US12262528B2Manufacturing method of memory structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 0367US12193214B2Manufacturing method for memory structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Jan 7, 2025·0 cites·19 claims
- 0465US11631642B2Method for manufacturing semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 18, 2023·0 cites·14 claims
- 0565US11527537B2Memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·7 claims
- 0664US11610897B2Landing pad structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Mar 21, 2023·0 cites·10 claims
- 0763US11476305B2Semiconductor device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Oct 18, 2022·0 cites·7 claims
- 0861US11342332B2Memory structure and manufacturing method thereforWINBOND ELECTRONICS CORP·Filed 2020·Granted May 24, 2022·0 cites·19 claims
- 0961US11217527B2Semiconductor device and manufacturing method of the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Jan 4, 2022·0 cites·7 claims
- 1061US2025227922A1Semiconductor device and formation method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1159US2025351344A1Semiconductor device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1258US2025212466A1Semiconductor device and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1358US2025167124A1Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1455US11011525B2Landing pad structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 18, 2021·0 cites·7 claims
- 1555US10847380B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 24, 2020·0 cites·11 claims
- 1655US2024250149A1Flash memory and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1754US11974424B2Memory device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 1851US10665471B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted May 26, 2020·0 cites·7 claims
- 1951US2024164087A1Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2050US2023309297A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2146US2005064563A1Nucleic acids for aminocoumarin biosynthesisFiled 2002·Application pending·0 cites
- 2240US2002015951A1Method of analyzing a nucleic acidFiled 2001·Application pending·0 cites
- 2337US10985262B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Apr 20, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →